I am Seoung-Jai Bai, former Ph. D student in Prof. Prinz group in mechanical engineering at Stanford.

Currently, I am working as an electroplating process engineer at Intel, Logic Technology Development in Oregon.

We are planning to hire one or two electroplating process engineers (Ph.D or Ph. D student) in the Thin films group.

The job is as a process engineer/module owner in the Thin Films group at Intel. 

The scope of work entails:

a). supporting process and chemical metrology development in 22nm and beyond silicon logic technology.
b). improving defect, electrical, reliability and yield performance
c). working with equipment vendors to aide product development and optimize hardware to improve safety, quality or output
d). engaging with a team of engineers and technicians to achieve common goals
e). training and transfering the technology to high volume manufacturing

If you are interested in the position, please feel free to contact Seoung-Jai Bai at seoung-jai.bai@intel.com