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When designing the process flow for any project,
carefully consider two questions for each and every process step:
Whether or not a wafer actually contains a specific contaminating material, such as gold, there is great risk of carrying over trace amounts of contaminant, when the wafer is processed in equipment which is normally exposed to other wafers containing this contaminant. Thus, equipment at SNF is grouped by level of contamination risk. For every process tool, equipment groups are designated for which wafers can be fed to, and accepted from, processing in that piece of equipment. Process flow sequence must be designed so that wafers are processed in equipment with equal or increasing contamination risk. Thus, wafers can be processed first in a tool in the "clean" group, and then in one from the "semi-clean" group, but generally not in the reverse order. Remember, that even if the process flow is consistent with the order of equipment groups, materials compatibility, particularly with respect to photoresist, must also be ensured for each piece of equipment. If you have processing requirements the guidelines provided here, please discuss your project with the SpecMat committee. For wafers receiving any processing outside of SNF, click <here>. More detailed information about the Materials Policies at SNF can be found at these links:
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Stanford Nanofabrication Facility webmaestro@snf.stanford.edu Last Modified 08/29/2003 |