LITHOGRAPHY TRAINING
Manual Coat Procedures
30 minute singe at 150C -
- Unless wafers just came out of a furnace or a deposition system (within
one hour) they must get 30 minutes singe in the 150C Oven before resist
coat. . This includes new material, wafers after furnace or deposition
(after more than 1 hour), and wafers after resist strip.
- Resist lifting during develop or etch will result without this step
- Place the wafers in a Teflon cassette (ok up to 180C) and place the cassette
in the Singe Oven.
HMDS (Hexamethyldisilazane) wafer prime must be
done before resist coat.
- HMDS promotes adhesion of the resist to the oxide on the wafer surface (starting
material, oxide films, nitride films because they have ~ 50A of oxide on top
of the nitride, Aluminum films also because of oxide on the surface of the
Aluminum, etc. all have improved adhesion with HMDS prime before coat.
- Use Personal Resist Bottles for the resist and the HMDS. Yellow
labels can be obtained from Sharleen. Or use your own designated clean
beakers (cover with foil when transferring from one hood to another). If you
use a beaker you MUST fill out a Blue Hazardous Label (see below) and keep
it with the beaker.
- For photo sensitive chemicals you should use brown glass bottles
for storage. The ones with the droppers built right in are the best for dispensing
HMDS and resist.
- Transfer all lithography chemicals with the stainless steel solvent
cart. No chemicals may be carried in the lab.
- Most lithography chemicals (including personal resist bottles with the yellow
labels) are stored in the two yellow cabinets behind the furnaces.
Some (i.e. Polyimides) are stored in the refrigerator or freezer behind
the ion implanter.
- Completely fill out the Blue Hazardous Labels (one for each beaker
or container that does not have a yellow personal label on it - even water
must have one) and keep it with the container. If you are working at the lithosolv
or wbmiscres benches you may check that the MSDS sheet for the chemical you
are using is there. If the MSDS sheet for the product is there, you
may list the product name instead of the percentage of every chemical in the
product. This option ONLY at these two benches because there is an
MSDS book at the bench. Other benches in the lab require the complete list
of all chemicals in the product.
- Make sure any open containers are at least 6 inches back from the
front of the exhaust hood. Never bring an open container out from under the
exhaust hood unless it is covered with foil. Also do not bring solvent or
resist contaminated items out from under the exhaust hood, unless it is in
a sealed plastic bag.
Manual Application of HMDS and Resist on
the headway2 spinner
- Vacuum check the system without a chuck. If it spins, write it up
as a problem on crystal and do not use it (your wafers may fly off the chuck
during the spin step).
- Select the appropriate chuck. Make sure it is clean and has an o-ring
on the inside. Choose the correct size chuck for your wafers.
- Vacuum check the system with the selected chuck. If it spins, choose
a different chuck or clean the one you have selected with Acetone.
- Set up the appropriate spin speed and time (see spin speed charts
for each resist in the lithography information book) using a dummy wafer.
Step on the front of the pedal to start the spin, and after the speed is set,
step on the back of the pedal if you want to stop it before the time is up.
- Place the first real wafer on the chuck and apply HMDS. Apply enough
to cover about 50% of the wafer surface before the spin. HMDS spreads easily
for a uniform coat.
- Place the protective plastic piece between you and the spinner
- Step on the front of the pedal to start the spin. When the
time is up it will stop spinning. You will see color changes as the HMDS thickness
changes.
- Apply photoresist to your wafer. Apply enough to cover about 50%
of the wafer surface.
- Place the protective plastic piece between you and the spinner
- Step on the front of the pedal to start the spin. When the
time is up it will stop spinning.
- Coating tips: If you notice some areas near the edge do not get covered
with resist, it may be necessary to increase the time (typically 30 seconds)
to 40 seconds and after applying the resist turn down the spin speed before
you step on the pedal. Let the resist spread across the wafer and then increase
the speed to the correct setting (just so the last 25 or 30 seconds is at
the correct speed to get the desired thickness).
- Bake resist. You could use a hotplate bake or an oven bake. Check
the webpages to see what bake temperature and time to use (you could just
mimic the procedure used for the svgcoat system for coating and baking information).
3612 is baked for 1 minute at 90C on a hot plate. You could
instead bake it at 90C in the oven for 25 minutes. When
you coat both sides of the wafers you must use the oven for the second coat.
- NEVER put resist side down on a hotplate. If you need to coat
both sides, bake in an oven for 25 minutes at the temp you need (90C or 110C)
instead of 1 minute on the hotplate.
Clean up.
- You should find fresh foil when you come up to use the spinner and
you should leave it that way. Do not leave your resist bottles or beakers
etc. at the bench.
There should be a roll of foil above both spinners. Replacement rolls
are on the top of the acid storage carts (along with gloves and wipes).
- Always dispose of solvent contaminated items properly. Never bring
solvent contaminated items out from under an exhaust hood unless they are
in a closed plastic bag (your glove can be used for small items). If you glove
is contaminated (i.e. with photoresist) turn it inside out to prevent fumes
during the transfer. Transfer the sealed bag under the hood of the lithosolv
bench and place the black bucket under the hood. Open the black bucket under
the hood and place the sealed bag in it. Replace the lid and clamp tightly
then transfer the black bucket back under the solvent bench.
- When the black bucket is full, place it under the hood and seal its
bag with a tie-wrap and transfer the sealed bag to the large white barrel
(remove the clamp and the lid and place the sealed bag inside, replace the
lid and secure the clamp).
- All of the lab air is 80% recirculated so any fumes released into
the air will stay in the lab for a long time. Notify the staff immediately
if you smell solvents. Evacuate the area and press the red button in the gowning
room if the smell is strong (doing this supplies the office area with
non-recirculated air, but the lab still remains 80% recirculated).
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Stanford Nanofabrication Facility
Last Modified
08/29/2003
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