Overview of Photolithography Tools

Aligner/Steppers

Name	Ultratech 1000	Karl Suss	EV 620	Nikon NSR
Type	1:1 Stepper	Contact	Contact/Prox	5:1 Stepper
Mask Size	3X5"	4" and 5"	5"	5"
Wafer Size	4" *	pieces-4"**	4"	4"
Maximum Exposure Area	sq. = 10 x 10 mm. rect = 21 x 7.2 mm	5" mask = 4" 4" mask = 3"	4" diameter	4"array
Obj. Separation	10- 21mm***	50-100mm		65mm
~ mininum resolution	1.25um lens rated****	1um	1um	.6um
Additional Features	Site-by-site stepper	Backside align	Anodic Bond,backside align	5:1 reduct.

Exposure Information

* 6 inch manual loader is also available.
** 4 inch diameter is the maximum
*** Aperture separation
**** Down to 0.8um can be achieved in isolated circumstances.

Spinners

Name	SVG	Laurel	Headway
Type	Auto/Manual Track	Manual	Manual
Wafer Size	4"	Pieces and substrates to 6"	pieces to 6", and 5"plates
Other Features	Dispenses photoresist adhesion promoters, and pre/postbakes.	Manual application of photoresist	Manual application of photoresist

Ovens

Temperature	90C	110C	150C	Programmable (up to 350C)
Type	Convection in N2	Convection in N2	Convection in N2	Convection in N2
Function	Prebake	Postbake	Singe	Cure

See process pages for more specific litho processing information. Return to Equipment page for information on specific tools.