My apologies, I had a brain lapse and completely confused drytek1 & 2
contamination groups, as 4 people gently pointed out (nice to know the
email was read!) Please see the correction below. And by the way,
there WILL be more info about the etchers forthcoming...
> Dear drytek1 users:
> As you may have heard, SNF will be installing 5 new etchers in coming
> months. In order to make room for the new, we must remove some of the
> So drytek1 will be removed from the lab -- while your normal etching
> needs will be supported by drytek2. For those of you who aren't
> familiar with drytek2, it has the identical gases and processes, but
> in a 6-electrode configuration and is in the "clean" equipment group.
> As part of the transition, two of the 6 wafer locations/electrodes are
> allocated for your "gold" processing normally done on drytek1. Because
> of the etcher configuration and chemistry of the drytek system, the
> our device/plasma experts believe cross-contamination risk between
> wafer slots is extremely low.
> Details, documentation, and logistics are being worked out now.
> Because of the different system/RF generator configuration, some
> retraining will be needed for those who are not yet qualified on
> drytek2. We don't have a definite date for this transition, but it
> could be as soon as within two weeks as we've just been informed the
> new Oxford etcher has shipped. Please be assured that we are working
> to have drytek2 in prime working order before then.
> Please stay tuned for more details in the coming week.If you have any
> concerns or special needs, do let us know.
> Thanks for your attention --
> Team Etch (Nancy, Elmer, Mike, Jim McV, Cesar, Mary)