Subject: Re: Drytek1 phase out
From: Mary Tang <mtang@stanford.edu>
Date: Wed, 21 Sep 2011 20:33:49 -0700

My apologies, I had a brain lapse and completely confused drytek1 & 2 
contamination groups, as 4 people gently pointed out (nice to know the 
email was read!)  Please see the correction below.  And by the way, 
there WILL be more info about the etchers forthcoming...

> Dear drytek1 users:
>
> As you may have heard, SNF will be installing 5 new etchers in coming 
> months.  In order to make room for the new, we must remove some of the 
> old....
>
> So drytek1 will be removed from the lab -- while your normal etching 
> needs will be supported by drytek2. For those of you who aren't 
> familiar with drytek2, it has the identical gases and processes, but 
> in a 6-electrode configuration and is in the "clean" equipment group. 
> As part of the transition, two of the 6 wafer locations/electrodes are 
> allocated for your "gold" processing normally done on drytek1. Because 
> of the etcher configuration and chemistry of the drytek system, the 
> our device/plasma experts believe cross-contamination risk between 
> wafer slots is extremely low.
>
> Details, documentation, and logistics are being worked out now.  
> Because of the different system/RF generator configuration, some 
> retraining will be needed for those who are not yet qualified on 
> drytek2. We don't have a definite date for this transition, but it 
> could be as soon as within two weeks as we've just been informed the 
> new Oxford etcher has shipped. Please be assured that we are working 
> to have drytek2 in prime working order before then.
>
> Please stay tuned for more details in the coming week.If you have any 
> concerns or special needs, do let us know.
>
> Thanks for your attention --
>
> Team Etch (Nancy, Elmer, Mike, Jim McV, Cesar, Mary)
>