Subject: RAITH system passes qualification and is up and on line for users. PLEASE READ ALL...
From: James Conway <jwc@snf.stanford.edu>
Date: Thu, 11 Jan 2007 18:14:39 -0800
Thu, 11 Jan 2007 18:14:39 -0800

*Greetings Raith Community:*

The RAITH 150 Ebeam system has passed it qualification run superbly with 
excellent Electron Beam Lithography structures having been written.

High Power Visual Microscope inspection at 200, 500, 1000X using 
Polarized Light exhibits excellent write field to write field stitching 
with no visible breaks in the vernier patterns.  Overlay alignment 
exposures  to previously written patterns on wafer 08222006_16, which 
was also used to re-qualify the system after downtime in December, also 
shows no breaks in the overlaid pattern structures.

I have saved all the default aperture and gun alignment settings and the 
Write Field Alignment Zoom, Shift, and Rotations values to the system 
database.  Users can be comfortable to accept these settings when 
prompted by the system after Load Lock exchanges have completed as a 
good starting point for your EBL operations.

SHORT CONTAMINATION DOTS MEASURE 10 - 11 nm. LEFT HAND MOUSE BUTTON DOTS 
MEASURE 22 - 25 nm.
IMAGE RIPPLE FROM VIBRATION IS LESS THAN 4 nm THIS MORNING.

DOSE TO CLEAR for 107 nm 2% 950K PMMA in Anisole is 110 to 115 uC/cm**2. 
Optimized dose for single pixel lines is 330 - 360 pC/cm

I have written a number of pattens that I will need to SEM and plan to 
develop ebeam scan measurement files to measure the sub 100 nm features. 
I will attempt to complete these task next week during cancellations on 
the system.


_*PLEASE READ ALL OF THESE NOTICES:*_

UNTIL FURTHER NOTICE *ALL USERS ARE RESTRICTED TO 10 keV AND BELOW 
ACCELERATION VOLTAGE* WHILE WE ALLOW THE GUN TO RUN IN AND THE GUN 
VACUUM PRESSURES TO FALL TO THE MID E-10 TORR LEVEL.  I WILL START 
ELEVATED ACC. VOLTAGE TESTING LATER NEXT WEEK.

*I REQUEST THAT ALL USERS WORKING ON THE SYSTEM THIS WEEK AND NEXT TO 
PLEASE POST A BRIEF SUMMARY OF THEIR RESULTS OBTAINED ON THE SYSTEM* TO 
CERTIFY MY RESULTS AND TO IDENTIFY ANY OTHER ISSUES TO ADDRESS ON THE 
SYSTEM.
*
_OUTSTANDING ISSUES TO BE RESOLVED:_*

*ZEISS SMT FIELD SERVICE CONCERNS:*
THE PRIMARY REASON FOR THE DELAY IN THE STARTUP AND QUALIFICATION WAS 
THAT ZEISS SMT DID NOT HONOR COMMITMENTS THEY HAD MADE FOR THURSDAY LAST 
WEEK TO PERFORM THE STARTUP OF THE SYSTEM. MONDAY THEY SHOWED UP TO 
PERFORM THIS WORK WHICH THEN DELAYED WORK RAITH FIELD SERVICE WAS TO 
PERFORM MONDAY. THIS WORK WAS COMPLETED IN A MARATHON OF TASKING  BY 
JOEL FRIDMANN AND MYSELF MONDAY THROUGH LATE TUESDAY.
FINALLY A LOSS OF THE RAITH PC OPERATING SYSTEM BOOT FUNCTION TOOK ALL 
OF YESTERDAY TO RESOLVE.

ZEISS FIELD SERVICE HAS NOT YET RETURNED TO COMPLETE ADJUSTMENTS TO THE 
MAG. AMPLIFIER CENTERING AND STIGMATION SECTION CENTERING FUNCTIONS OF 
THE SEM AS PROMISED. THEY HAVE NOT RESPONDED TO MY EMAILS OR CALLS.
SO USERS MAY SEE SHIFTS IN THE POSITION OF THE SEM IMAGE WHEN YOU ARE 
ADJUSTING STIGMATION AT HIGH MAGNIFICATION. [BE SURE TO PERFORM YOUR 
APERTURE ALIGNMENT CAREFULLY AND COMPLETELY BEFORE MOVING TO STIGMATION 
TO AVOID CONFUSION.]

*FE-GUN EMISSION LEVELS:*
WE WILL BE RAISING THE EXTRACTION VOLTAGE AND POSSIBLY FILAMENT CURRENT 
TO INCREASE EMISSION OF THE FE-GUN TO LEVELS WE NORMALLY HAVE HAD IN THE 
PAST AND TO OPTIMAL SETTINGS FOR EBEAM LITHOGRAPHY.

NOTE:  THEIR IS SOME DEEPER SCRATCHES IN THE SURFACE OF THE STD.SAMPLE 
HOLDER.  ALL USERS ARE REQUESTED TO BE CAREFUL LOADING THEIR SUBSTRATES 
INTO THE SYSTEM AND TO EMPLOY PLASTIC / FRP OR TEFLON COATED TWEEZERS TO 
PERFORM THE FINAL POSITIONING OF THEIR SAMPLES.

*AVOID CONTAMINATION TO THE SYSTEM:*
*ALL USERS SHOULD BE VIGILANT TO AVOID ADDING CONTAMINANTS TO THE SYSTEM 
*BY CHANGING THEIR GLOVES AFTER THEY OPEN THE LOAD LOCK DOOR BEFORE 
REMOVING THE STD. SAMPLE HOLDER. NO WAXES, EPOXIES, GREASES, OR CARBON 
TAPE OTHER THAN SPECTRA-PURE CARBON DOTS ARE TO BE INTRODUCED IN TO THE 
SYSTEM. 

*ALL SUBSTRATES SHOULD BE SOFT BAKED AT 90 DEGREES OR ABOVE FOR 2 
MINUTES BEFORE LOADING INTO THE SYSTEM.

*PLEASE CONTACT ME DURING MY OFFICE HOUR IF YOU HAVE ANY QUESTIONS, 
PROBLEMS, OR CONCERNS.

THANK YOU FOR YOUR SUPPORT DURING THE COURSE OF THIS DIFFICULT START UP 
FOR THE NEW YEAR.
LETS PUSH THE LIMITS OF WHAT WE CAN DO ON THE SYSTEM IN 2007!

ALL THE VERY BEST TO EVERYONE IN THE NEW YEAR,

JAMES CONWAY
*
*



Greetings Raith Community:

The RAITH 150 Ebeam system has passed it qualification run superbly with excellent Electron Beam Lithography structures having been written.

High Power Visual Microscope inspection at 200, 500, 1000X using Polarized Light exhibits excellent write field to write field stitching with no visible breaks in the vernier patterns.  Overlay alignment exposures  to previously written patterns on wafer 08222006_16, which was also used to re-qualify the system after downtime in December, also shows no breaks in the overlaid pattern structures.

I have saved all the default aperture and gun alignment settings and the Write Field Alignment Zoom, Shift, and Rotations values to the system database.  Users can be comfortable to accept these settings when prompted by the system after Load Lock exchanges have completed as a good starting point for your EBL operations.

SHORT CONTAMINATION DOTS MEASURE 10 - 11 nm. LEFT HAND MOUSE BUTTON DOTS MEASURE 22 - 25 nm.
IMAGE RIPPLE FROM VIBRATION IS LESS THAN 4 nm THIS MORNING.

DOSE TO CLEAR for 107 nm 2% 950K PMMA in Anisole is 110 to 115 uC/cm**2. Optimized dose for single pixel lines is 330 - 360 pC/cm

I have written a number of pattens that I will need to SEM and plan to develop ebeam scan measurement files to measure the sub 100 nm features. I will attempt to complete these task next week during cancellations on the system.


PLEASE READ ALL OF THESE NOTICES:

UNTIL FURTHER NOTICE ALL USERS ARE RESTRICTED TO 10 keV AND BELOW ACCELERATION VOLTAGE WHILE WE ALLOW THE GUN TO RUN IN AND THE GUN VACUUM PRESSURES TO FALL TO THE MID E-10 TORR LEVEL.  I WILL START ELEVATED ACC. VOLTAGE TESTING LATER NEXT WEEK.

I REQUEST THAT ALL USERS WORKING ON THE SYSTEM THIS WEEK AND NEXT TO PLEASE POST A BRIEF SUMMARY OF THEIR RESULTS OBTAINED ON THE SYSTEM TO CERTIFY MY RESULTS AND TO IDENTIFY ANY OTHER ISSUES TO ADDRESS ON THE SYSTEM.

OUTSTANDING ISSUES TO BE RESOLVED:


ZEISS SMT FIELD SERVICE CONCERNS:
THE PRIMARY REASON FOR THE DELAY IN THE STARTUP AND QUALIFICATION WAS THAT ZEISS SMT DID NOT HONOR COMMITMENTS THEY HAD MADE FOR THURSDAY LAST WEEK TO PERFORM THE STARTUP OF THE SYSTEM. MONDAY THEY SHOWED UP TO PERFORM THIS WORK WHICH THEN DELAYED WORK RAITH FIELD SERVICE WAS TO PERFORM MONDAY. THIS WORK WAS COMPLETED IN A MARATHON OF TASKING  BY JOEL FRIDMANN AND MYSELF MONDAY THROUGH LATE TUESDAY.
FINALLY A LOSS OF THE RAITH PC OPERATING SYSTEM BOOT FUNCTION TOOK ALL OF YESTERDAY TO RESOLVE.

ZEISS FIELD SERVICE HAS NOT YET RETURNED TO COMPLETE ADJUSTMENTS TO THE MAG. AMPLIFIER CENTERING AND STIGMATION SECTION CENTERING FUNCTIONS OF THE SEM AS PROMISED. THEY HAVE NOT RESPONDED TO MY EMAILS OR CALLS.
SO USERS MAY SEE SHIFTS IN THE POSITION OF THE SEM IMAGE WHEN YOU ARE ADJUSTING STIGMATION AT HIGH MAGNIFICATION. [BE SURE TO PERFORM YOUR APERTURE ALIGNMENT CAREFULLY AND COMPLETELY BEFORE MOVING TO STIGMATION TO AVOID CONFUSION.]

FE-GUN EMISSION LEVELS:
WE WILL BE RAISING THE EXTRACTION VOLTAGE AND POSSIBLY FILAMENT CURRENT TO INCREASE EMISSION OF THE FE-GUN TO LEVELS WE NORMALLY HAVE HAD IN THE PAST AND TO OPTIMAL SETTINGS FOR EBEAM LITHOGRAPHY.

NOTE:  THEIR IS SOME DEEPER SCRATCHES IN THE SURFACE OF THE STD.SAMPLE HOLDER.  ALL USERS ARE REQUESTED TO BE CAREFUL LOADING THEIR SUBSTRATES INTO THE SYSTEM AND TO EMPLOY PLASTIC / FRP OR TEFLON COATED TWEEZERS TO PERFORM THE FINAL POSITIONING OF THEIR SAMPLES.

AVOID CONTAMINATION TO THE SYSTEM:
ALL USERS SHOULD BE VIGILANT TO AVOID ADDING CONTAMINANTS TO THE SYSTEM BY CHANGING THEIR GLOVES AFTER THEY OPEN THE LOAD LOCK DOOR BEFORE REMOVING THE STD. SAMPLE HOLDER. NO WAXES, EPOXIES, GREASES, OR CARBON TAPE OTHER THAN SPECTRA-PURE CARBON DOTS ARE TO BE INTRODUCED IN TO THE SYSTEM. 

ALL SUBSTRATES SHOULD BE SOFT BAKED AT 90 DEGREES OR ABOVE FOR 2 MINUTES BEFORE LOADING INTO THE SYSTEM.

PLEASE CONTACT ME DURING MY OFFICE HOUR IF YOU HAVE ANY QUESTIONS, PROBLEMS, OR CONCERNS.

THANK YOU FOR YOUR SUPPORT DURING THE COURSE OF THIS DIFFICULT START UP FOR THE NEW YEAR.
LETS PUSH THE LIMITS OF WHAT WE CAN DO ON THE SYSTEM IN 2007!

ALL THE VERY BEST TO EVERYONE IN THE NEW YEAR,

JAMES CONWAY