Problem AG4100 SNF 2008-08-29 18:17:04: Simulation Information

emyers at snf.stanford.edu emyers at snf.stanford.edu
Fri Aug 29 18:17:05 PDT 2008


skoh did TSUPREM simulations to determine the difference in reported vs. actual chamber temperature for the qual.
Simulated Qual thickness is supposed to be ~120A.  Measured results (7-25-08) were ~70A.  According to simulation, this corresponds to a temperature difference of ~75deg.  Typical Qual oxide thickness is ~100Ang.




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