From eenriquez at snf.stanford.edu Mon Dec 1 14:15:12 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 1 Dec 2008 14:15:12 -0800 Subject: Comment AG4100 SNF 2008-12-01 14:15:11: Update Message-ID: Door not fully opening or closing . Still troubleshooting. From eenriquez at snf.stanford.edu Wed Dec 3 16:13:05 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Dec 2008 16:13:05 -0800 Subject: Shutdown AG4100 SNF 2008-11-14 15:04:18: Chamber Repair Message-ID: Performed pyrometer calibration, ran 15 wafers using the Qual 1150 recipe with no problems. Adjusted the door locking mechanism , now door leak is gone. Ran Ti test wafers and did not see any discoloration. From eenriquez at snf.stanford.edu Wed Dec 3 16:14:51 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Dec 2008 16:14:51 -0800 Subject: Comment AG4100 SNF 2008-11-21 14:48:56: Update Message-ID: Archived From eenriquez at snf.stanford.edu Wed Dec 3 16:14:59 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Dec 2008 16:14:59 -0800 Subject: Comment AG4100 SNF 2008-11-26 15:35:44: Nov. 26, 08 Update Message-ID: Archived From eenriquez at snf.stanford.edu Wed Dec 3 16:15:03 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Dec 2008 16:15:03 -0800 Subject: Comment AG4100 SNF 2008-12-01 14:15:11: Update Message-ID: From eenriquez at snf.stanford.edu Wed Dec 3 16:15:15 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Dec 2008 16:15:15 -0800 Subject: Comment AG4100 SNF 2008-11-26 22:41:02: Power Message-ID: Archived From eenriquez at snf.stanford.edu Wed Dec 3 16:19:39 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Dec 2008 16:19:39 -0800 Subject: Problem AG4100 SNF 2008-12-03 16:19:39: Needs to run a process qual Message-ID: Process has not been tested. Need to verify process results prior to comitting your actual samples. From shott at snf.stanford.edu Thu Dec 4 11:40:02 2008 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Thu, 4 Dec 2008 11:40:02 -0800 Subject: Problem AG4100 SNF 2008-12-03 16:19:39: Needs to run a process qual Message-ID: I've run the process qual and seem to get a mean thickness that is close to that expected on the AG4108. I don't know about on-wafer uniformity .... but overall, this looks pretty good to my untrained eye. See the following Qualification Comment for details ... John From shott at snf.stanford.edu Thu Dec 4 13:37:43 2008 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Thu, 4 Dec 2008 13:37:43 -0800 Subject: Comment AG4100 SNF 2008-12-04 13:37:43: Results of QUAL1150 recipe ... Message-ID: AG4100 Users: The AG4100 chamber had been completely rebuilt to alleviate blockage in the cooling lines, the door closure mechanism has been adjusted, a pyrometer calibration has been performed, and we've just run a wafer qualification that, I believe, looks reasonable ... Folks with more experience with this tool, however, should look over the results to insure that things look OK to them as well. In particular, there is significant on-wafer (mostly back to front) thickness variation and I don't have enough experience on this tool to know what is expected in this regard. Here are the results of the 5 test wafers (note: these were all L-prime wafers that had a normal pre-diffusion clean. This was running the 1150 Qual recipe which is basically a 30 second oxidation at 1150 degrees C. Wafer 1 2 3 4 5 6 7 8 9 Mean StDev 1 107.23 108.77 111.35 121.71 128.61 119.41 114.62 113.18 122.2 116.3422 7.082508 2 109.06 110.39 115.16 125.87 127.66 126.18 117.64 114.47 113.39 117.7578 7.083262 3 109.45 111.27 114.38 123.58 128.21 122.55 118.39 111.98 113.55 117.04 6.475757 4 109.87 110.76 113.57 121.29 125.08 126.33 118.76 111.47 114.48 116.8456 6.245929 5 108.28 109.88 112.32 119.12 119.68 119.45 116.67 110.27 117.71 114.82 4.602293 Note: the 1 through 9 positions are the standard Woollam positions .... 1 is the top of the wafer, 5 is the flat, 6 is the left side and 9 is the right side. The wafers were loaded so that the flat was at the bottom of the cassette in the AG4100 so that when inserted in the oven, the flat sits away from the door and the top of the wafer is nearest the door. As a result, you can see that the oxide thickness is lowest closest to the door and highest at the deepest reaches of the furnace. I don't know how this compares to normal on-wafer variation in this tool to know whether better uniformity is to be expected, but the wafer to wafer variation seems to be quite good. If I am not mistaken, for some time this 1150 recipe was giving noticeably thinner results in the AG4100 than observed in the AG4108. These mean thickness of about 115 angstrom is, I believe, quite close to what is observed on the AG4108 for the same recipe. In any event, pending further discussion, I'm releasing this tool as "green" under the assumption that each of you will evaluate and consider this on wafer uniformity to see how it meets your needs. Happy processing, John p.s. We are expecting the rebuilt AG4108 chamber to be returned early next week ... From raneeyoo at snf.stanford.edu Fri Dec 12 23:29:45 2008 From: raneeyoo at snf.stanford.edu (raneeyoo at snf.stanford.edu) Date: Fri, 12 Dec 2008 23:29:45 -0800 Subject: Comment AG4100 SNF 2008-12-12 23:29:45: over temp Message-ID: while I was running, there was an error.....such as...over temperature.....after waiting some time, I ran again....it seems the system is not fully stable.... From jackson at snf.stanford.edu Sat Dec 13 22:51:25 2008 From: jackson at snf.stanford.edu (jackson at snf.stanford.edu) Date: Sat, 13 Dec 2008 22:51:25 -0800 Subject: Problem AG4100 SNF 2008-12-13 22:51:24: no cooling water...overtemps Message-ID: From shott at snf.stanford.edu Sun Dec 14 11:16:28 2008 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sun, 14 Dec 2008 11:16:28 -0800 Subject: Problem AG4100 SNF 2008-12-13 22:51:24: no cooling water...overtemps Message-ID: Wow, was this a strange one ..... 1. The supply and return had been reversed ... likely when the AG 4108 was being reinstalled on Friday. 2. This, I believe, did 2 things: First, the water control solenoid (that is permanently plugged into the power strip, likely doesn't really flow water in the reverse direction. However, I also believe that reversing the flow on the Kobold flow switch likely jammed it so that it may have still been registering a flow .... otherwise, I don't know how it could have allowed the lamps to come on. So, we've now got the flow in bothmachines in the correct direction. However, the Kobold flow switch is not dropping out when we have zero flow. I will be working to get a replacement flow switch ASAP. In the meantime, however, the machine should be fine to run. Thanks, John From shott at snf.stanford.edu Sun Dec 14 11:16:43 2008 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sun, 14 Dec 2008 11:16:43 -0800 Subject: Comment AG4100 SNF 2008-12-12 23:29:45: over temp Message-ID: Wow, was this a strange one ..... 1. The supply and return had been reversed ... likely when the AG 4108 was being reinstalled on Friday. 2. This, I believe, did 2 things: First, the water control solenoid (that is permanently plugged into the power strip, likely doesn't really flow water in the reverse direction. However, I also believe that reversing the flow on the Kobold flow switch likely jammed it so that it may have still been registering a flow .... otherwise, I don't know how it could have allowed the lamps to come on. So, we've now got the flow in bothmachines in the correct direction. However, the Kobold flow switch is not dropping out when we have zero flow. I will be working to get a replacement flow switch ASAP. In the meantime, however, the machine should be fine to run. Thanks, John From eenriquez at snf.stanford.edu Thu Dec 18 07:55:08 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 18 Dec 2008 07:55:08 -0800 Subject: Shutdown AG4100 SNF 2008-12-18 07:55:07: Facilities electrical work Message-ID: