Comment AG4100 SNF 2009-04-22 16:59:46: Update

eenriquez at snf.stanford.edu eenriquez at snf.stanford.edu
Wed Apr 22 16:59:47 PDT 2009


Swapped one of the  thermal switches with an existing but unused one.
Process 28 wafers (8 + 10 + 10) using the Qual 1150 recipe with no problems.
Before the change, the system faulted for "Top plate over temp" when the external thermocouple (TC 1) reading ~ 36 C after about 30 sec @ 900 C.  After the change, the system faulted after 240 sec @ 900 C when the external TC read about 90 C.
Monitored the external TC (top plate temp) during the Qual 1150 ,10 wafer process run.  The maximum temperature increased with each succesive wafer with the 10th wafer reaching 80 C.  The max temperature of the last 5 wafers only increased by < 1 C.




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