From ajamo at snf.stanford.edu Fri May 7 03:28:56 2010 From: ajamo at snf.stanford.edu (ajamo at snf.stanford.edu) Date: Fri, 7 May 2010 03:28:56 -0700 Subject: Shutdown AG4100 SNF 2010-05-07 03:28:56: Cooling Water leak Message-ID: Cooling water leak. unplugged the coolant pump and closed the supply and return valves. From mdickey at snf.stanford.edu Fri May 7 09:10:38 2010 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Fri, 7 May 2010 09:10:38 -0700 Subject: Shutdown AG4100 SNF 2010-05-07 03:28:56: Cooling Water leak Message-ID: replaced water line From emyers at snf.stanford.edu Fri May 7 14:59:14 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 7 May 2010 14:59:14 -0700 Subject: Shutdown AG4100 SNF 2010-05-07 14:59:13: Water Problems Message-ID: I was restarting the system when I noticed <0.5 gpm flow. The water valves were open but the pump was unplugged. The pump is leaking and the secondary confinement is half full of water. I shut off the water valves and empted some of the water. From mdickey at snf.stanford.edu Mon May 10 08:39:10 2010 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Mon, 10 May 2010 08:39:10 -0700 Subject: Shutdown AG4100 SNF 2010-05-07 14:59:13: Water Problems Message-ID: Replaced leaky fitting From skoh at snf.stanford.edu Mon May 10 18:10:36 2010 From: skoh at snf.stanford.edu (skoh at snf.stanford.edu) Date: Mon, 10 May 2010 18:10:36 -0700 Subject: Shutdown AG4100 SNF 2010-05-10 18:10:36: Chamber Door and Air Flow Message-ID: Chamber door does not open. It also appears that the air is not flowing. From eenriquez at snf.stanford.edu Tue May 11 09:55:07 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 11 May 2010 09:55:07 -0700 Subject: Comment AG4100 SNF 2010-05-11 09:55:07: Update Message-ID: Electronics cards got wet during the leak. Now the software can't connect to the A/D card. Contacted field service. Waiting for a reply as to when they can send an engineer to work on the system. From eenriquez at snf.stanford.edu Thu May 13 13:59:36 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 13 May 2010 13:59:36 -0700 Subject: Comment AG4100 SNF 2010-05-13 13:59:36: Update Message-ID: Field service currently working on the tool. From eenriquez at snf.stanford.edu Thu May 13 15:25:53 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 13 May 2010 15:25:53 -0700 Subject: Comment AG4100 SNF 2010-05-13 15:25:52: Update Message-ID: Vendor replaced a bad power supply. Need to test the system and run a process qual. From eenriquez at snf.stanford.edu Fri May 14 09:49:36 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 14 May 2010 09:49:36 -0700 Subject: Shutdown AG4100 SNF 2010-05-10 18:10:36: Chamber Door and Air Flow Message-ID: Cycled 4 wafers with no problems. Now waiting for a qual. From emyers at snf.stanford.edu Fri May 14 15:33:37 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 14 May 2010 15:33:37 -0700 Subject: Comment AG4100 SNF 2010-05-14 15:33:37: Qual. May 14, 2010 Message-ID: Ran 5 wafers in automatic. Measured on Woollam using RTO Qual program. Results in Angstroms. wafer 1: Avg 132 SD 7.7 wafer 2: Avg 132 SD 7.7 wafer 3: Avg 134 SD 8.1 System Over Temp'd on wafer #4. wafer 4: Not Ran wafer 5: Not Ran February Qual thickness was 130 Ang. If we could have ran 5 wafers I would have considered the system to be qualified. From emyers at snf.stanford.edu Fri May 14 15:35:42 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 14 May 2010 15:35:42 -0700 Subject: Problem AG4100 SNF 2010-05-14 15:35:41: Failed Qualification Message-ID: System failed for overtemperature during the fourth wafer. System water flow is 0.5-0.6 gpm against a specification of 2.0 gpm. The qualification oxide thickness for the three wafers which did run were within specification (132 Ang.) and within 2 angstroms of the Feb. Qual. From ajamo at snf.stanford.edu Fri May 14 23:56:31 2010 From: ajamo at snf.stanford.edu (ajamo at snf.stanford.edu) Date: Fri, 14 May 2010 23:56:31 -0700 Subject: Shutdown AG4100 SNF 2010-05-14 23:56:30: Coolant hose came off Message-ID: Coolant hose came off during anneal. Large puddle of coolant around the machine. I unplugged the pump and turned off the two coolant line valves. pushed the EMO button. I got as many yellow pads as there was, some of the liquid barrier snakes and absorbant pillows. Put up yellow Caution stands and roped off area with caution tape. Test wafer is still inside the machine. From cbaxter at snf.stanford.edu Sun May 16 07:18:43 2010 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 16 May 2010 07:18:43 -0700 Subject: Comment AG4100 SNF 2010-05-16 07:18:42: Update Message-ID: Air dried system and cleaned all electronic pcb with ipa and then air dried. will power it up tomorrow(smoke test). From cbaxter at snf.stanford.edu Mon May 17 13:08:39 2010 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Mon, 17 May 2010 13:08:39 -0700 Subject: Comment AG4100 SNF 2010-05-17 13:08:38: Cooling Lines Message-ID: In progress of fushing cooling manifold.. From cursive at snf.stanford.edu Tue May 18 16:13:08 2010 From: cursive at snf.stanford.edu (cursive at snf.stanford.edu) Date: Tue, 18 May 2010 16:13:08 -0700 Subject: Problem AG4100 SNF 2010-05-18 16:13:07: Will RTA4100 be up this week? Message-ID: Because SCT will be retired next Mondsay, is it possible to repair RTA4100 this week? I am planing to do silicide in RTA 4100. From jhaydon at snf.stanford.edu Wed May 19 14:26:09 2010 From: jhaydon at snf.stanford.edu (jhaydon at snf.stanford.edu) Date: Wed, 19 May 2010 14:26:09 -0700 Subject: Comment AG4100 SNF 2010-05-19 14:26:09: repaired water flow to tool Message-ID: Water flowes disconnected form manifold are: Chamber 1.2 GPM Thermal shield above chamber 1.1 GPM Door shield 0.8 GPM Door 0.8 Gpm with a water pressure of 75 psi Water flow running through both mainflods connected with 75 psi water pressure is currently 2.5 GPM From shott at snf.stanford.edu Wed May 19 16:47:45 2010 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Wed, 19 May 2010 16:47:45 -0700 Subject: Problem AG4100 SNF 2010-05-19 16:47:44: Swivel motors (cassette rotation) not working Message-ID: After Jim got the 2.5 GPM wafer flow restored, Ed and I powered up the system to see how far we could get. Most things came up with no problems and we could intialize the robot. At the moment, however, the swivel motors that control the rotation of the send/receive cassettes is not working. Following is Rick Forney's message about this: Note: I've left a copy of this email and the circuit information on the table to the right of the 4100 in hopes that Cesar might be in to take a look at this. Otherwise, in the morning, we will take off the screen and see if we have DC power to this board and see if we have something as simple as a fuse problem. Hi John, There is a control board for the cassette swivel motors on the left side of the machine (between the receive cassette and the cooling station) under the screen. There is a small access panel on the left side of the machine. The Allwin21 software does not control the cassette swivel motors. We usually disable these. I will try to find the schematic for this board and send it to you. Rick Forney Sr. Systems Engineer Allwin21 Corp. 3521 Leonard Court Santa Clara, CA 95054 USA 408-988-5188 rickforney at allwin21.com www.allwin21.com From shott at snf.stanford.edu Thu May 20 08:08:37 2010 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Thu, 20 May 2010 08:08:37 -0700 Subject: Problem AG4100 SNF 2010-05-19 16:47:44: Swivel motors (cassette rotation) not working Message-ID: Corroded contact on leftmost relay on the swivel motor board. Fuses were good. Cleaning relay contacts returned swivel motors to proper postition. Note: Rick Forney sent us circuit schematics of this board. John From shott at snf.stanford.edu Thu May 20 08:10:21 2010 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Thu, 20 May 2010 08:10:21 -0700 Subject: Problem AG4100 SNF 2010-05-18 16:13:07: Will RTA4100 be up this week? Message-ID: We hope so .... chilled water (on a distilled water closed-loop chiller is flowing at 2.5 GPM. System boots and initializes properly. Ed will check process functionality ... John From shott at snf.stanford.edu Thu May 20 08:21:50 2010 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Thu, 20 May 2010 08:21:50 -0700 Subject: Comment AG4100 SNF 2010-05-16 07:18:42: Update Message-ID: Jim Haydon ompleted cleaning of system cooling lines, flow testing of individual channels, and conversion to closed-loop heat exchanger. From shott at snf.stanford.edu Thu May 20 08:22:00 2010 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Thu, 20 May 2010 08:22:00 -0700 Subject: Comment AG4100 SNF 2010-05-17 13:08:38: Cooling Lines Message-ID: Jim Haydon ompleted cleaning of system cooling lines, flow testing of individual channels, and conversion to closed-loop heat exchanger. From shott at snf.stanford.edu Thu May 20 08:23:03 2010 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Thu, 20 May 2010 08:23:03 -0700 Subject: Comment AG4100 SNF 2010-05-19 14:26:09: repaired water flow to tool Message-ID: Excellent total flow of 2.5 GPM on the Neslab System II chiller. From eenriquez at snf.stanford.edu Thu May 20 15:29:37 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 20 May 2010 15:29:37 -0700 Subject: Comment AG4100 SNF 2010-05-20 15:29:37: Mechanical testing Message-ID: Installed strain relief for the the door cooling lines. Wiped down the wafer load area. Cycled two wafers with no problems. Wafer cassettes are very dirty. need to clean the From emyers at snf.stanford.edu Fri May 21 11:56:02 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 11:56:02 -0700 Subject: Shutdown AG4100 SNF 2010-05-14 23:56:30: Coolant hose came off Message-ID: After all the work the systems seems to be running very well. The cooling flow is 2.5gpm at 75 psi. We the system was first installed we never reached 2gpm and the last failure occured at 0.5 gpm. I ran the qual wafers and they came out good. Thank you for all the work. From emyers at snf.stanford.edu Fri May 21 15:54:53 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 15:54:53 -0700 Subject: Comment AG4100 SNF 2010-05-21 15:54:52: Qual. May 21, 2010 Message-ID: Ran 5 wafers in automatic. Measured on Woollam using RTO Qual program. Results in Angstroms. wafer 1: Avg 134 SD 5.6 wafer 2: Avg 138 SD 8.0 wafer 3: Avg 134 SD 7.3 wafer 4: Avg 133 SD 6.2 wafer 5: Avg 132 SD 6.6 May 14 Qual was 132 Ang February Qual thickness was 130 Ang. From emyers at snf.stanford.edu Fri May 21 15:55:27 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 15:55:27 -0700 Subject: Problem AG4100 SNF 2010-05-14 15:35:41: Failed Qualification Message-ID: Passed Qual on May 21 after cleaning of chamber water lines. From emyers at snf.stanford.edu Fri May 21 15:56:43 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 15:56:43 -0700 Subject: Problem AG4100 SNF 2010-04-12 14:21:58: failed long 500C anneal Message-ID: Lab member running 500C or 10 minutes without failure. He is seeing the temperature drop out at 7 minutes when running at 550C From emyers at snf.stanford.edu Fri May 21 15:56:51 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 15:56:51 -0700 Subject: Comment AG4100 SNF 2010-02-27 22:59:10: Rebooted - Okay Message-ID: archived From emyers at snf.stanford.edu Fri May 21 15:56:58 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 15:56:58 -0700 Subject: Comment AG4100 SNF 2010-04-08 14:01:06: Fitting Message-ID: archived From emyers at snf.stanford.edu Fri May 21 15:57:04 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 15:57:04 -0700 Subject: Comment AG4100 SNF 2010-05-11 09:55:07: Update Message-ID: archived From emyers at snf.stanford.edu Fri May 21 15:57:13 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 15:57:13 -0700 Subject: Comment AG4100 SNF 2010-05-13 13:59:36: Update Message-ID: archived From emyers at snf.stanford.edu Fri May 21 15:57:20 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 15:57:20 -0700 Subject: Comment AG4100 SNF 2010-05-13 15:25:52: Update Message-ID: archived From emyers at snf.stanford.edu Fri May 21 15:57:30 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 15:57:30 -0700 Subject: Comment AG4100 SNF 2010-05-20 15:29:37: Mechanical testing Message-ID: archived From emyers at snf.stanford.edu Fri May 21 16:00:20 2010 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 21 May 2010 16:00:20 -0700 Subject: Comment AG4100 SNF 2010-05-21 16:00:20: Water flow at 2.5gpm Message-ID: After cleaning out the cooling lines the system water flow is just above 2.5gpm at 75psi on a heat exchanger. When the tool was installed flow was just below 2gpm. During the 5 wafer, 1150C, 30sec qual run the temperature sensors installed by John peaked around 28C. In previous runs the senor temperature increased about 25C with each wafer. From ryhuang at snf.stanford.edu Fri May 21 17:01:25 2010 From: ryhuang at snf.stanford.edu (ryhuang at snf.stanford.edu) Date: Fri, 21 May 2010 17:01:25 -0700 Subject: Problem AG4100 SNF 2010-05-21 17:01:25: lamp dropout for long (10min) 550C run... Message-ID: Ran several wafers for as long as 10min at both 450C and 500C without any problems. >2.5gpm water flow and both top and bottom Tc readings were in the 19C-26C range. However, lamps shut down when running 550C, 10min anneal. Tried running 3 times and lamps shut down at ~7min the 1st 2 times, ~3min the 3rd time. From ryhuang at snf.stanford.edu Wed May 26 13:07:20 2010 From: ryhuang at snf.stanford.edu (ryhuang at snf.stanford.edu) Date: Wed, 26 May 2010 13:07:20 -0700 Subject: Problem AG4100 SNF 2010-05-26 13:07:20: last wafer peeled... Message-ID: Surface film from my last wafer peeled during a 550C N2 anneal. Visual inspection of chamber looks OK. I will also run some test wafers through when I return in an hour to anneal the rest of my wafers. Robert From ryhuang at snf.stanford.edu Wed May 26 17:43:36 2010 From: ryhuang at snf.stanford.edu (ryhuang at snf.stanford.edu) Date: Wed, 26 May 2010 17:43:36 -0700 Subject: Comment AG4100 SNF 2010-05-26 17:43:35: peeling wafer update - ran add'l wafers OK... Message-ID: I ran 3 test wafers and did not see any visible defects/particles on them as they came out of the chamber. I then ran 12 of my product wafers, and they also looked OK. Robert From mdickey at snf.stanford.edu Thu May 27 10:30:19 2010 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Thu, 27 May 2010 10:30:19 -0700 Subject: Comment AG4100 SNF 2010-05-27 10:30:18: fludh Message-ID: Flushed the system and changed the water filter