Problem AG4100 SNF 2010-05-26 13:07:20: last wafer peeled...

ryhuang at snf.stanford.edu ryhuang at snf.stanford.edu
Wed May 26 13:07:20 PDT 2010


Surface film from my last wafer peeled during a 550C N2 anneal.  Visual inspection of chamber looks OK.  I will also run some test wafers through when I return in an hour to anneal the rest of my wafers.
Robert




More information about the AG4100-pcs mailing list