Shutdown AG4108 SNF 2008-05-30 14:59:33: FAILED PROCESS QUAL

emyers at snf.stanford.edu emyers at snf.stanford.edu
Fri May 30 14:59:33 PDT 2008


The system failed process qual.  The average thickness was 20-30% to high and there was significant problems with the 5th wafer ran which seems to be temperature related.  This wafer was also sigificantly thicker oxide (higher effective temperature) than the four previous wafers.




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