Comment AG4108 SNF 2009-04-30 14:47:25: Update over temp problem

eenriquez at snf.stanford.edu eenriquez at snf.stanford.edu
Fri May 1 10:00:04 PDT 2009


Cooling water flow = 3.2 gpm (booster pump on)
Ran 10 wafers using the Qual 1150 recipe without problems
     -top plate temperature cycled from 21 C to 28 C from the start of the process to the end of the heat cycle.
     -bottom plate temperature cycled from 51 C to 60C.
The bottom plate might need to be cleaned out some more but I believe that its ok to run.




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