Comment AG4108 SNF 2009-05-01 18:12:59: Process Qual Data

skoh at snf.stanford.edu skoh at snf.stanford.edu
Fri May 1 18:12:59 PDT 2009


Ran 5 wafers (flats up) in automatic on 5/1. Measured on Woollam using RTO Qual program. Results in Angstroms. Recipe data in skoh-09May01.
wafer 1: Avg 112 StdDev 4.0
wafer 2: Avg 122 StdDev 4.1
wafer 3: Avg 127 StdDev 7.7
wafer 4: Avg 122 StdDev 5.3
wafer 5: Avg 123 StdDev 5.1
Appears thicker than the quals reported by Ed on 1/07.  Looking at the wafers with flat down, the left side of the wafer is consistently thicker, giving thicknesses as high as 139A.




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