From robinhmb at yahoo.com  Tue Aug  1 21:30:58 2006
From: robinhmb at yahoo.com (Robin King)
Date: Tue, 1 Aug 2006 21:30:58 -0700 (PDT)
Subject: 4100  Shutdown --  Temp control errors
Message-ID: <20060802043059.35941.qmail@web54706.mail.yahoo.com>

Posting to 4108 since the problem report email bounces for the 4100:
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Subject: Shutdown AG4100 SNF 2006-08-01 20:11:26: Impossible
Date: Tue, 1 Aug 2006 20:11:26 -0700
From: king at snf.stanford.edu
To: AG4100-pcs at snf.stanford.edu

In addition to the screen problems, the calibration seems to be so
far off that the lamp power cycles like crazy.  Have rewritten the
intial power five different ways and have copied previous recipes to
no avail.

Before green-lighting this one could you please run the standard RTO
on Si and verify that it's working reliably?  Thanks.




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From eenriquez at snf.stanford.edu  Thu Aug  3 14:18:30 2006
From: eenriquez at snf.stanford.edu (Elmer Enriquez)
Date: Thu, 03 Aug 2006 14:18:30 -0700
Subject: AG4108, 4100 Update
Message-ID: <44D26826.7050101@snf.stanford.edu>

The AG4108 and AG4100 are both experiencing various software related 
problem.  Field service along with the software engineer will here on 
Monday to either fix the problems or re-install the older version of 
software.
We will change the 4108 quartzware tomorrow and perform the pyrometer 
calibration on Monday.


From robinhmb at yahoo.com  Mon Aug 14 23:53:15 2006
From: robinhmb at yahoo.com (Robin King)
Date: Mon, 14 Aug 2006 23:53:15 -0700 (PDT)
Subject: Dirty wafers run in AG annealers
Message-ID: <20060815065316.67431.qmail@web54702.mail.yahoo.com>

It appears that wafers which were not cleaned have been run in the
4108 and 4100 at elevated temperatures.  This seems to be an
ongoing issue generating a great deal of concern.  
  
The rule is that ALL wafers must have been cleaned in an approved
manner within an hour before processing (if this has changed please
let us know). 

Dummy wafers stored in a cassette, either in an enclosed box or in
the open air in a machine cassette, do not somehow have a free pass
permitting them to go uncleaned, contaminating the chamber and
subsequently loaded device wafers.  

Please remember that these are clean furnace tubes like Tylan 1 and 2
and therefore all lab users, process and maintenance staff need to
show consideration of others' research by being mindful of their
cleanliness habits. 

At this point it would be good to clean both chambers.



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From robinhmb at yahoo.com  Fri Aug 18 12:21:55 2006
From: robinhmb at yahoo.com (Robin King)
Date: Fri, 18 Aug 2006 12:21:55 -0700 (PDT)
Subject: oxidation recipe
Message-ID: <20060818192155.18514.qmail@web54702.mail.yahoo.com>

For anyone wanting to check the tempurature calibration on the 4108
or 4100 so they can run wafers, it's easy to diffusion clean some
lightly doped test wafers and run this recipe. Be sure to run a few
cleaned dummy wafers ahead of the real test wafers. 
AG field service sent a copy of the conditions they use:  O2, 1150C,
30 seconds, ramp at 100C/sec.  Result should be 120A or close using
the ellipsometer program 11.  
It would be good to start doing this again on a regular basis, such
as during training etc.





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From rwoo at stanford.edu  Fri Aug 18 16:37:56 2006
From: rwoo at stanford.edu (Raymond Woo)
Date: Fri, 18 Aug 2006 16:37:56 -0700
Subject: oxidation recipe
In-Reply-To: <20060818192155.18514.qmail@web54702.mail.yahoo.com>
References: <20060818192155.18514.qmail@web54702.mail.yahoo.com>
Message-ID: <44E64F54.30102@stanford.edu>

We ran an oxidation test this afternoon with 4 wafers using the recipe 
that Robin suggested below.  The actual ramp rate was a bit low (~60 
deg/sec) but that can probably be fixed with an optimized recipe.  The 
ellipsometer measured oxide thicknesses varied between 102A and 117A. 
 From TSUPREM simulations this corresponds to a worst case temperature 
error of between 5 and 10 deg.  I've kept the individual wafer 
printouts, so if anyone would like the more detailed results just let me 
know.

First Wafer: avg=108 std dev=2.8
Second Wafer: avg=102 std dev=3.9
Third Wafer: avg=115 std dev=3.0
Fourth Wafer: avg=117 std dev=3.8

- Ray





Robin King wrote:
> For anyone wanting to check the tempurature calibration on the 4108
> or 4100 so they can run wafers, it's easy to diffusion clean some
> lightly doped test wafers and run this recipe. Be sure to run a few
> cleaned dummy wafers ahead of the real test wafers. 
> AG field service sent a copy of the conditions they use:  O2, 1150C,
> 30 seconds, ramp at 100C/sec.  Result should be 120A or close using
> the ellipsometer program 11.  
> It would be good to start doing this again on a regular basis, such
> as during training etc.
> 
> 
> 
> 
> 
> __________________________________________________
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> Tired of spam?  Yahoo! Mail has the best spam protection around 
> http://mail.yahoo.com