From jparker at snf.stanford.edu Thu Jul 12 15:08:38 2012 From: jparker at snf.stanford.edu (jparker at snf.stanford.edu) Date: Thu, 12 Jul 2012 15:08:38 -0700 Subject: Problem amtetcher SNF 2012-07-12 15:08:38: Vaccuum wand tip spins Message-ID: The plastic part at the end of the vaccuum wand is abnormally loose and rotates freely. From cbaxter at snf.stanford.edu Thu Jul 12 16:20:56 2012 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Thu, 12 Jul 2012 16:20:56 -0700 Subject: Problem amtetcher SNF 2012-07-12 15:08:38: Vaccuum wand tip spins Message-ID: Changed vacuum wand.. From latta at snf.stanford.edu Wed Jul 18 12:54:40 2012 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 18 Jul 2012 12:54:40 -0700 Subject: Comment amtetcher SNF 2012-06-05 09:50:58: tray support Message-ID: archived From latta at snf.stanford.edu Wed Jul 18 12:54:53 2012 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 18 Jul 2012 12:54:53 -0700 Subject: Comment amtetcher SNF 2012-05-30 20:08:04: debris Message-ID: thanks From latta at snf.stanford.edu Wed Jul 18 12:55:19 2012 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 18 Jul 2012 12:55:19 -0700 Subject: Comment amtetcher SNF 2012-05-06 18:50:44: process #3 etch rate Message-ID: archived From latta at snf.stanford.edu Wed Jul 18 12:55:58 2012 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 18 Jul 2012 12:55:58 -0700 Subject: Comment amtetcher SNF 2012-02-14 18:21:41: Quals after annual shutdown and renovation Message-ID: archived From levi at snf.stanford.edu Mon Jul 23 20:41:36 2012 From: levi at snf.stanford.edu (levi at snf.stanford.edu) Date: Mon, 23 Jul 2012 20:41:36 -0700 Subject: Problem amtetcher SNF 2012-07-23 20:41:36: Residue in chamber and on wafers Message-ID: Helo everyone, I have used the AMT today for my regular etch of nano-holes, using NF3 (15 sccm, 40 mtorr, -390 V). I have noticed that there was a brown residue on the window, but could not find Elmer to check it out before starting. The seasoning and first calibration runs were OK, with normal etch rates of 350 Ang./min for SiNx wafers as previous runs. However, after the etch, there was also a residue on my wafers. I will check later the performance of the etch in SEM, but it may have also deposited on the side walls of the nano-holes I made. I did not see this before. Can it happen from not doing a proper process 2 descum before I started ? Ofer From mdickey at snf.stanford.edu Tue Jul 24 07:26:55 2012 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Tue, 24 Jul 2012 07:26:55 -0700 Subject: Comment amtetcher SNF 2012-07-24 07:26:54: Base plate Message-ID: Cleaned base plate and replaced outer viewport From eenriquez at snf.stanford.edu Tue Jul 24 08:42:43 2012 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 24 Jul 2012 08:42:43 -0700 Subject: Problem amtetcher SNF 2012-07-23 20:41:36: Residue in chamber and on wafers Message-ID: Cleaned the chamber and view port From xzhuan1 at snf.stanford.edu Mon Jul 30 19:16:16 2012 From: xzhuan1 at snf.stanford.edu (xzhuan1 at snf.stanford.edu) Date: Mon, 30 Jul 2012 19:16:16 -0700 Subject: Comment amtetcher SNF 2012-07-30 19:16:15: Prog3 oxide etch rate 250nm/min Message-ID: Etched 40 min for about 1um of oxide. Rate is low. From latta at snf.stanford.edu Tue Jul 31 11:49:53 2012 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 31 Jul 2012 11:49:53 -0700 Subject: Comment amtetcher SNF 2012-07-30 19:16:15: Prog3 oxide etch rate 250nm/min Message-ID: run qual for 2 min, 366A/min. Advised user to do polymer removal etches every 10-15 mins during long etches. From latta at snf.stanford.edu Tue Jul 31 11:51:10 2012 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 31 Jul 2012 11:51:10 -0700 Subject: Comment amtetcher SNF 2012-07-31 11:51:10: Qucik ck after user comment Message-ID: Prog #3, 2 mins, -523V 366A/min, thermal oxide