From jrjain at stanford.edu Sun Aug 3 14:54:14 2008 From: jrjain at stanford.edu (Raja Jain) Date: Sun, 3 Aug 2008 14:54:14 -0700 Subject: amtetcher free now Message-ID: <000001c8f5b3$78cc86c0$6a659440$@edu> Problems with upstream equipment. -------------- next part -------------- An HTML attachment was scrubbed... URL: From jlsuar at gmail.com Tue Aug 5 10:16:42 2008 From: jlsuar at gmail.com (josephine suarez) Date: Tue, 5 Aug 2008 10:16:42 -0700 Subject: Reservations removed from 10 to 12 noon today Message-ID: Finished early -------------- next part -------------- An HTML attachment was scrubbed... URL: From chongxie.stanford at gmail.com Thu Aug 7 22:19:37 2008 From: chongxie.stanford at gmail.com (Chong Xie) Date: Thu, 7 Aug 2008 22:19:37 -0700 Subject: Turbo went off Message-ID: <96fc32f70808072219g7f59d974jcd8f1cc70dae26f7@mail.gmail.com> The turbo was off when I try to use the machine tonight, and the system was vented. Never tried to open the chamber. I couldn't find anyone can help me with the situation, and have to leave it like this. chong -- Chong Xie Ph. D Candidate Cui Group The Geballe Laboratory for Advanced Materials 476 Lomita Mall, Stanford University Stanford, CA 94305 -------------- next part -------------- An HTML attachment was scrubbed... URL: From nlatta at stanford.edu Wed Aug 13 17:23:17 2008 From: nlatta at stanford.edu (Nancy Latta) Date: Wed, 13 Aug 2008 17:23:17 -0700 Subject: Changes to base pressure Message-ID: <48A37AF5.9040305@stanford.edu> Hello Everyone, One of the things to come out of the Etch Quality Circle is a better understanding of why the base pressure for the tool had been set to 0.5mT. It seems that when to etcher was purchased it was configured for metal etching. It was never used as a metal etching tool, however. A major concern with metal etching is moisture and pumping down to very low base pressures assured moisture-free etching. We really do not need to pump down to 0.5mT for the processes we run in the amtetcher. I have changed all the standard recipes (1,2,3,4,5 and 7) and their back-up recipes (11,12,13,14,15 and 17) to have a base pressure of 0.8mT. I have also reflected that change on the newly laminated Recipes and Etch Rates Sheet in the logbook. This should put an end to the annoyingly long pump downs we have recently been experiencing and bring peace back to Etchland. All comments welcome, -Nancy From eap at gloworm.Stanford.EDU Wed Aug 13 18:32:58 2008 From: eap at gloworm.Stanford.EDU (Eric Perozziello) Date: Wed, 13 Aug 2008 18:32:58 -0700 (PDT) Subject: Changes to base pressure In-Reply-To: <48A37AF5.9040305@stanford.edu> Message-ID: I agree that the absolute base pressure is not essential for an oxide etch, but I'm afraid that the failure to reach the "usual" base pressure is really a symptom of a large leak rate. On a few occasions, I measured that rate, and it was unacceptably high (which I think I noted in coral). Given the relaxation in the programmed base pressure, can we have regular leakup rates measured and logged somewhere? And yellow-light the machine if it exceeds 5 or 10 mT/min? Thanks, -Eric On Wed, 13 Aug 2008, Nancy Latta wrote: > Hello Everyone, > > One of the things to come out of the Etch Quality Circle is a better > understanding of why the base pressure for the tool had been set to > 0.5mT. It seems that when to etcher was purchased it was configured for > metal etching. It was never used as a metal etching tool, however. > > A major concern with metal etching is moisture and pumping down to very > low base pressures assured moisture-free etching. We really do not need > to pump down to 0.5mT for the processes we run in the amtetcher. > > I have changed all the standard recipes (1,2,3,4,5 and 7) and their > back-up recipes (11,12,13,14,15 and 17) to have a base pressure of > 0.8mT. I have also reflected that change on the newly laminated Recipes > and Etch Rates Sheet in the logbook. > > This should put an end to the annoyingly long pump downs we have > recently been experiencing and bring peace back to Etchland. > > All comments welcome, > > -Nancy > > From ahryciw at gmail.com Mon Aug 18 16:25:52 2008 From: ahryciw at gmail.com (Aaron Hryciw) Date: Mon, 18 Aug 2008 16:25:52 -0700 Subject: Cancelling amtetcher reservation: 14:30-16:30, Aug. 18 Message-ID: <4d36fb940808181625m4916d0eagc0c30742b710a2dc@mail.gmail.com> -- Aaron Hryciw Postdoctoral Scholar Geballe Laboratory for Advanced Materials Stanford University 476 Lomita Mall (04-490) McCullough Building, Rm. 325 Stanford, CA 94305-4045 Tel.: (650) 723-5840 Fax.: (650) 736-1984 -------------- next part -------------- An HTML attachment was scrubbed... URL: From chongxie.stanford at gmail.com Tue Aug 19 21:52:57 2008 From: chongxie.stanford at gmail.com (Chong Xie) Date: Tue, 19 Aug 2008 21:52:57 -0700 Subject: Plasma color changed Message-ID: <96fc32f70808192152p9212c8fkaed803d6dd4c9e9e@mail.gmail.com> Hello everyone, I am now running the recipe 4 seasoning. I noticed that the color of the plasma has changed. It's light purple now, and I remember it was brighter before. And I can't see through the plasma now, before I could clearly see the wafer and the electrode. Has anyone noticed that too? It looks really strange. chong -- Chong Xie Ph. D Candidate Cui Group The Geballe Laboratory for Advanced Materials 476 Lomita Mall, Stanford University Stanford, CA 94305 -------------- next part -------------- An HTML attachment was scrubbed... URL: From renshen at stanford.edu Tue Aug 19 22:10:19 2008 From: renshen at stanford.edu (Shen Ren) Date: Tue, 19 Aug 2008 22:10:19 -0700 Subject: Plasma color changed In-Reply-To: <96fc32f70808192152p9212c8fkaed803d6dd4c9e9e@mail.gmail.com> References: <96fc32f70808192152p9212c8fkaed803d6dd4c9e9e@mail.gmail.com> Message-ID: <628a66910808192210g6c2f45b2v34e2e7d97d30d0ac@mail.gmail.com> Hi Chong, Can you double check your program? I did a NF3 etch later this afternoon. The plasma of my process has a pinkish color. Maybe you need to run a longer conditioning for your process. Shen On Tue, Aug 19, 2008 at 9:52 PM, Chong Xie wrote: > Hello everyone, > I am now running the recipe 4 seasoning. I noticed that the color of the > plasma has changed. It's light purple now, and I remember it was brighter > before. And I can't see through the plasma now, before I could clearly see > the wafer and the electrode. Has anyone noticed that too? It looks really > strange. > > chong > > -- > Chong Xie > Ph. D Candidate > Cui Group > The Geballe Laboratory for Advanced Materials > 476 Lomita Mall, Stanford University > Stanford, CA 94305 > -- Best wishes, Shen Ren Department of Electrical Engineering Stanford University Success is not the key to happiness. Happiness is the key to success. If you love what you are doing, you will be successful. -Albert Schweitzer From cmcg at stanford.edu Sun Aug 24 17:57:45 2008 From: cmcg at stanford.edu (Christopher McGuinness) Date: Sun, 24 Aug 2008 17:57:45 -0700 Subject: AMT free 8-9:30pm Message-ID: <393d7fe80808241757i109d7660qc5bdcdf863813eae@mail.gmail.com> finished early -------------- next part -------------- An HTML attachment was scrubbed... URL: From takane at stanford.edu Tue Aug 26 14:14:05 2008 From: takane at stanford.edu (Takane Usui) Date: Tue, 26 Aug 2008 14:14:05 -0700 Subject: amt released 2:30-3:30 Message-ID: <48B4721D.7000303@stanford.edu> I'm sorry for the late notice. -Takane