From shott at stanford.edu Sun Jun 1 14:39:12 2008 From: shott at stanford.edu (John Shott) Date: Sun, 01 Jun 2008 14:39:12 -0700 Subject: System status .... Message-ID: <48431700.8080809@stanford.edu> amtetcher community: This weekend, Cesar rebuilt a number of important elements of this system. In particular, he replaced the set of O-rings that seal the hexode assembly. He also cleaned and replaced the bell jar liner and the gas distribution tubes. Finally, he cleaned the base plate, the inside of the bell jar (the part that is normally hidden by the bell jar liner, and the "roof" of the bell jar. While it will take a while to know for sure, we are hopeful that these things will improved the post-midnight pumping situation. Regardless, they are things which needed to be done. After this major teardown, we've run process 3 a couple of times and process 2 a couple of times to season the system. However, at this point we do not know what the etch rates are or what the uniformity looks like. As a result, I would caution anyone who plans to use this tool to proceed with the utmost caution. In particular, I would not risk important wafers in it until we have done some testing of etch rates and selectivity. While Nancy will be out on vacation, I'll try to work with other staff members to see if we can get this tool checked out tomorrow. I have removed the shutdown .... but please be forewarned, this tool has not been checked out since this major rebuild. Thanks, John From chris.mcguinness at gmail.com Mon Jun 2 09:40:50 2008 From: chris.mcguinness at gmail.com (Christopher McGuinness) Date: Mon, 2 Jun 2008 09:40:50 -0700 Subject: amt reservation removed monday 4-6pm Message-ID: <393d7fe80806020940u7122180etb828454841fd5ba3@mail.gmail.com> -------------- next part -------------- An HTML attachment was scrubbed... URL: From cmcg at stanford.edu Tue Jun 3 17:38:08 2008 From: cmcg at stanford.edu (Christopher McGuinness) Date: Tue, 3 Jun 2008 17:38:08 -0700 Subject: anyone notice any major changes in etch rates or uniformity since the upgrade/cleaning? Message-ID: <393d7fe80806031738u259e4d7cx9bbdec695aedb5d6@mail.gmail.com> -------------- next part -------------- An HTML attachment was scrubbed... URL: From jrjain at stanford.edu Mon Jun 16 12:53:19 2008 From: jrjain at stanford.edu (Raja Jain) Date: Mon, 16 Jun 2008 12:53:19 -0700 Subject: amtetcher free at 2:30pm Message-ID: <000c01c8cfea$a0e7c5a0$e2b750e0$@edu> -------------- next part -------------- An HTML attachment was scrubbed... URL: From masaharu at stanford.edu Tue Jun 24 20:51:57 2008 From: masaharu at stanford.edu (Masaharu Kobayashi) Date: Tue, 24 Jun 2008 20:51:57 -0700 Subject: amt etcher reservation release until 9:30pm Message-ID: <20080624205157.qujz42ff48s48wog@webmail.stanford.edu> Sorry for short notice From jrjain at stanford.edu Sun Jun 29 12:35:22 2008 From: jrjain at stanford.edu (Raja Jain) Date: Sun, 29 Jun 2008 12:35:22 -0700 Subject: amtetcher free until 4pm Message-ID: <007701c8da1f$46686ff0$d3394fd0$@edu> Apologies for late notice -------------- next part -------------- An HTML attachment was scrubbed... URL: From takane at stanford.edu Sun Jun 29 17:22:00 2008 From: takane at stanford.edu (Takane Usui) Date: Sun, 29 Jun 2008 17:22:00 -0700 Subject: amtetcher etch rate Message-ID: <48682728.40201@stanford.edu> Hi AMT users, I've been using the amtetcher program 3 to etch SiO2, and noticed that the etch rate seems lower than the listed value 371A/min. Did anyone notice the same trend? Did anyone calibrate / measure the current etch rate of program 3? I appreciate your advice! Thanks, Takane -- Takane Usui School of Engineering Graduate Research Fellow Rapid Prototyping Laboratory Stanford University takane at stanford.edu http://www-rpl.stanford.edu/ From gthareja at stanford.edu Sun Jun 29 22:54:06 2008 From: gthareja at stanford.edu (gthareja at stanford.edu) Date: Sun, 29 Jun 2008 22:54:06 -0700 Subject: amtetcher free. samples not ready ! Message-ID: <20080629225406.zh3x08ljacoggww8@webmail.stanford.edu>