From cursive at ee.ucla.edu Mon Aug 8 16:30:35 2011 From: cursive at ee.ucla.edu (cursive at ee.ucla.edu) Date: Mon, 8 Aug 2011 16:30:35 -0700 (PDT) Subject: AMT is free from now to 6:30 pm. Message-ID: <49668.171.66.172.103.1312846235.squirrel@webmail-ee.seas.ucla.edu> AMT is free from now to 6:30 pm. Sample is not ready, and sorry for the late notice. From cursive at ee.ucla.edu Mon Aug 8 16:30:40 2011 From: cursive at ee.ucla.edu (cursive at ee.ucla.edu) Date: Mon, 8 Aug 2011 16:30:40 -0700 (PDT) Subject: AMT is free from now to 6:30 pm. Message-ID: <49670.171.66.172.103.1312846240.squirrel@webmail-ee.seas.ucla.edu> AMT is free from now to 6:30 pm. Sample is not ready, and sorry for the late notice. From cursive at ee.ucla.edu Mon Aug 8 16:30:46 2011 From: cursive at ee.ucla.edu (cursive at ee.ucla.edu) Date: Mon, 8 Aug 2011 16:30:46 -0700 (PDT) Subject: AMT is free from now to 6:30 pm. Message-ID: <49672.171.66.172.103.1312846246.squirrel@webmail-ee.seas.ucla.edu> AMT is free from now to 6:30 pm. Sample is not ready, and sorry for the late notice. From sclaussen at stanford.edu Tue Aug 30 19:49:38 2011 From: sclaussen at stanford.edu (Stephanie Claussen) Date: Tue, 30 Aug 2011 19:49:38 -0700 Subject: amtetcher available now until 9pm Message-ID: From sclaussen at stanford.edu Tue Aug 30 22:08:17 2011 From: sclaussen at stanford.edu (Stephanie Claussen) Date: Tue, 30 Aug 2011 22:08:17 -0700 Subject: 220-3 in amtetcher? Message-ID: Hi, I was wondering if anyone had experience with using 220-3 as an etch mask in amtetcher. I've used it for a while, doing a post-develop bake in the 110C oven for 30-60 minutes. However, I realized over the past few days that this bake is causing my resist to reflow and messing up my pattern. I tried to skip the bake, but that caused my resist to burn during a 12 minute Process 3 etch (I have not seen resist burning before). Someone mentioned doing a UV cure to aid the resist during the etch. Has anyone done this successfully? Or have any other input? I need thick resist due to my long etch times. I could do >1.6um 3612, but this would require characterization steps I'd rather not do. Thanks, Stephanie