Etching ASML targets with amtetcher

Benjamin Chui bwchui at yahoo.com
Thu Jul 7 19:06:10 PDT 2011


Correction: for unrelated reasons I did do a 3-minute Recipe-3 etch beforehand on the same wafer with the same resist pattern, which is expected to take off around 100A .  So the next etch depth attributable to recipe 4 should be about 0.15um.

Ben

--- On Thu, 7/7/11, Benjamin Chui <bwchui at yahoo.com> wrote:

From: Benjamin Chui <bwchui at yahoo.com>
Subject: Re: Etching ASML targets with amtetcher
To: amtetcher at snf.stanford.edu, "Nahid Harjee" <nharjee at stanford.edu>
Date: Thursday, July 7, 2011, 6:37 PM

I did a 5.4 minute (recipe 4) etch on the AMT yesterday (July 6) and got an etch depth of 0.16um per Zygo.

Ben

--- On Sun, 7/3/11, Nahid Harjee <nharjee at stanford.edu> wrote:

From: Nahid Harjee <nharjee at stanford.edu>
Subject: Etching ASML targets with amtetcher
To: amtetcher at snf.stanford.edu
Date: Sunday, July 3, 2011, 6:21 PM

Hi amtetcher community,

Have any of you recently used amtetcher to successfully etch ASML targets? The recommended process is 5 min of Program 4. In November 2010 when I last ran this process, it yielded trench depths of 1150 A (measured with zygo) which is close to the desired 1200 A. However, when I ran it again yesterday, the trench depths were
 only 700 A. Have others also noticed this large change in etch rate?


Thanks,

nh

-- 
Nahid Harjee
Ph.D. Candidate
Electrical Engineering
Stanford University
408-761-8651

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