From mahnaz at snf.stanford.edu Wed Aug 13 10:07:04 2008 From: mahnaz at snf.stanford.edu (mahnaz at snf.stanford.edu) Date: Wed, 13 Aug 2008 10:07:04 -0700 Subject: Shutdown asml SNF 2008-08-13 10:07:03: exahust work Message-ID: From gsosa at snf.stanford.edu Wed Aug 13 14:15:39 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Wed, 13 Aug 2008 14:15:39 -0700 Subject: Shutdown asml SNF 2008-08-13 10:07:03: exahust work Message-ID: The exhaust work is completed. Restarted and warmed up the lamp. Checked uniformity- OK @ 1.7%. Ran IQC test all critical parameters are in spec. System OK to use. From gsosa at snf.stanford.edu Thu Aug 14 14:27:05 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 14 Aug 2008 14:27:05 -0700 Subject: Comment asml SNF 2008-08-14 14:27:02: Lamp change Completed Message-ID: ASML replaced and set up the UV lamp. Uniformity is at 1.41% From gsosa at snf.stanford.edu Sun Aug 17 11:03:35 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Sun, 17 Aug 2008 11:03:35 -0700 Subject: Shutdown asml SNF 2008-08-17 11:03:35: Testing in Progress Message-ID: Doing qualification tests on new overlay wafers From gsosa at snf.stanford.edu Sun Aug 17 19:27:54 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Sun, 17 Aug 2008 19:27:54 -0700 Subject: Shutdown asml SNF 2008-08-17 11:03:35: Testing in Progress Message-ID: Completed metrology measurement of 14 overlay wafers. The data will be modeled and reviewed by ASML applications group. System is back up and ready to use. From gsosa at snf.stanford.edu Mon Aug 18 16:36:45 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Mon, 18 Aug 2008 16:36:45 -0700 Subject: Shutdown asml SNF 2008-08-18 16:36:44: System stabilizing Message-ID: System is stabilizing after the power failure. From gsosa at snf.stanford.edu Mon Aug 18 17:50:37 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Mon, 18 Aug 2008 17:50:37 -0700 Subject: Comment asml SNF 2008-08-18 17:50:36: Update 8/18/2008 Message-ID: The stepper stepper is still down. The temperature 63 degrees and humidity 63% in the lab are out of spec and causing tool stabilizing problems. The stepper is .25 microns out of focus.The stepper will continue to drift as the temperature drops through the night, until the lab's temp humidity controls are fully functional. From gsosa at snf.stanford.edu Tue Aug 19 16:19:48 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Tue, 19 Aug 2008 16:19:48 -0700 Subject: Comment asml SNF 2008-08-19 16:19:47: Tool Update 8/19/2008 Message-ID: The stepper is still down. Temp and humidity control was restored to the lab at 7:00 AM. We are allowing the stepper and lab to come back into equilibrium and ASML field service will check out tool tomorrow morning. As of 1:30PM the stepper focus is still drifting. From gsosa at snf.stanford.edu Wed Aug 20 13:46:33 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Wed, 20 Aug 2008 13:46:33 -0700 Subject: Shutdown asml SNF 2008-08-18 16:36:44: System stabilizing Message-ID: The stepper is now stable. Focus and red/blue verified good by ASML field service engineer. From mahnaz at snf.stanford.edu Wed Aug 20 15:02:28 2008 From: mahnaz at snf.stanford.edu (mahnaz at snf.stanford.edu) Date: Wed, 20 Aug 2008 15:02:28 -0700 Subject: Shutdown asml SNF 2008-08-20 15:02:28: Calibrating 3D Message-ID: Recalibrating 3D, due to power outage we have lost the vacuum to the chuck. From mahnaz at snf.stanford.edu Wed Aug 20 17:11:28 2008 From: mahnaz at snf.stanford.edu (mahnaz at snf.stanford.edu) Date: Wed, 20 Aug 2008 17:11:28 -0700 Subject: Shutdown asml SNF 2008-08-20 15:02:28: Calibrating 3D Message-ID: 3D is calibrated and the front side is ready to go. By the way, FSE cleaned the E chuck as well. From mahnaz at snf.stanford.edu Fri Aug 22 16:16:05 2008 From: mahnaz at snf.stanford.edu (mahnaz at snf.stanford.edu) Date: Fri, 22 Aug 2008 16:16:05 -0700 Subject: Shutdown asml SNF 2008-08-22 16:16:05: shutters are not closing Message-ID: I hate to do this on a Friday but we found out that the shutters are not closing properly. This impact the exposure and we will see exposer drift across each field . The part has been ordered and the FSE will be here on Monday to take care of the issue. From gsosa at snf.stanford.edu Mon Aug 25 15:50:59 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Mon, 25 Aug 2008 15:50:59 -0700 Subject: Shutdown asml SNF 2008-08-22 16:16:05: shutters are not closing Message-ID: FSE checked and made adjustments to shutter assembly. There are no more light leaks and dose repeatability looks good in sevice tests. Checked E0 using KS coat process. E0 is at 57mj. This is what it was last week. Please take tests wafers to verify your process and exposure. I will have the applications group retest E0 in the morning. From gsosa at snf.stanford.edu Mon Aug 25 15:51:36 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Mon, 25 Aug 2008 15:51:36 -0700 Subject: Problem asml SNF 2008-08-25 15:51:34: Update 08/25/2008 Message-ID: FSE checked and made adjustments to shutter assembly. There are no more light leaks and dose repeatability looks good in sevice tests. Checked E0 using KS coat process. E0 is at 57mj. This is what it was last week. Please take tests wafers to verify your process and exposure. I will have the applications group retest E0 in the morning. From gsosa at snf.stanford.edu Tue Aug 26 14:35:55 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Tue, 26 Aug 2008 14:35:55 -0700 Subject: Problem asml SNF 2008-08-25 15:51:34: Update 08/25/2008 Message-ID: ASML rechecked the EO. the E0 today is at 55 mj. this is within the range that the tool has been running at (55 - 60 mj. System OK to use. From gsosa at snf.stanford.edu Tue Aug 26 16:40:39 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Tue, 26 Aug 2008 16:40:39 -0700 Subject: Comment asml SNF 2008-08-26 16:40:39: Wafer stuck in machine Message-ID: There were 3 wafers stranded in the tool( P-Chuck, E-chuck and robot), E-chuck and robot wafers were exposed. P-chuck wafer had a vacuum error which caused the handling problem and stranded wafers. The problem was a vacuum sensor error when transfering from P-chuck to centering chuck in pre-aligner. Manually removed and authorized wafer out. Removed 2 other wafers through software. Cleaned the pre-align chuck with IPA. Inspected users wafer- looked OK , nothing unusual and he said it floated OK on granite. User re-ran his 2 good wafers to complete his layer processing. No problems. Advised user to try suspect wafer when staf and ASML support are here. System OK to use. From kevhuang at snf.stanford.edu Sun Aug 31 11:35:35 2008 From: kevhuang at snf.stanford.edu (kevhuang at snf.stanford.edu) Date: Sun, 31 Aug 2008 11:35:35 -0700 Subject: Problem asml SNF 2008-08-31 11:35:35: wafer stuck in machine Message-ID: could not remove using software (couldn't determine wafer location) From gsosa at snf.stanford.edu Sun Aug 31 14:54:03 2008 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Sun, 31 Aug 2008 14:54:03 -0700 Subject: Problem asml SNF 2008-08-31 11:35:35: wafer stuck in machine Message-ID: Wafer recovered through software reboot by user nppatil. System ran fine afterwards. no wafer handling issues. Wafer was stuck at pre-aligner.