From gsosa at snf.stanford.edu Tue May 1 18:34:54 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Tue, 1 May 2012 18:34:54 -0700 Subject: Shutdown asml SNF 2012-04-27 15:09:00: Tool Shutdown 4/27 Message-ID: ASML vendor inspected level sensor optics and ran many diagnostics test to verify the integrity of the level sensor optics. Performed BMCcalibrations and updated M/C's. Performed white lite FEM , Tilt to Tilt maching and updated MC's. Performed Red/Blue test and optimized system state. Redefined system reference state for IQC test.ing. Repeated R/B test to confirm good system state- All OK. Checked lamp uniformity- OK. Exposed a hotspot wafer- OK. System is up for frontside align only. 3D alignment system to be calibrated at a later date. Please inspect your wafers closely after exposure and report any problms, if any. From gsosa at snf.stanford.edu Tue May 1 18:35:49 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Tue, 1 May 2012 18:35:49 -0700 Subject: Comment asml SNF 2012-05-01 18:35:48: Up for frontside align Only 5/1 Message-ID: ASML vendor inspected level sensor optics and ran many diagnostics test to verify the integrity of the level sensor optics. Performed BMCcalibrations and updated M/C's. Performed white lite FEM , Tilt to Tilt maching and updated MC's. Performed Red/Blue test and optimized system state. Redefined system reference state for IQC test.ing. Repeated R/B test to confirm good system state- All OK. Checked lamp uniformity- OK. Exposed a hotspot wafer- OK. System is up for frontside align only. 3D alignment system to be calibrated at a later date. Please inspect your wafers closely after exposure and report any problms, if any. From maxms at snf.stanford.edu Wed May 2 19:57:46 2012 From: maxms at snf.stanford.edu (maxms at snf.stanford.edu) Date: Wed, 2 May 2012 19:57:46 -0700 Subject: Comment asml SNF 2012-05-02 19:57:45: wafer hood broken Message-ID: The hood that you open and close to load the wafer cassette into is broken - both hinges are snapped. chill out, hulk. From gsosa at snf.stanford.edu Thu May 3 09:28:38 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 3 May 2012 09:28:38 -0700 Subject: Shutdown asml SNF 2012-05-03 09:28:38: Shutdown 5/3 Message-ID: ASML needs to investigate a potential wafer scratching problem. From gsosa at snf.stanford.edu Thu May 3 11:06:17 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 3 May 2012 11:06:17 -0700 Subject: Comment asml SNF 2012-05-02 19:57:45: wafer hood broken Message-ID: Replaced the hinges on the input port cover. From gsosa at snf.stanford.edu Thu May 3 12:33:56 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 3 May 2012 12:33:56 -0700 Subject: Shutdown asml SNF 2012-05-03 09:28:38: Shutdown 5/3 Message-ID: No problem found. User found out from company that the scrateches to the right of the major flat were from prior processing. What appears to be scratches near the center portion of the wafer are most likely poor spin. As a precaution 5 resist coated wafers wee processed through the tool using normal batch operations. This was repeated 10 times, inspecting the wafers in between every batch cycle for a total of 50 wafer transfers. No scratches were observed. An additional 50 wafer transfers were done using the test manager(multi-batch cycling. Also, no scratches were observed. System is OK. ASML to continue with 3D align setup. From gsosa at snf.stanford.edu Thu May 3 12:37:04 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 3 May 2012 12:37:04 -0700 Subject: Shutdown asml SNF 2012-05-03 12:37:04: 3D Align Setup 5/3 Message-ID: ASML to continue the 3D align setup/calibrations. From gsosa at snf.stanford.edu Thu May 3 15:59:05 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 3 May 2012 15:59:05 -0700 Subject: Shutdown asml SNF 2012-05-03 12:37:04: 3D Align Setup 5/3 Message-ID: ASML completed 3D align setup/calibrations. All 3D align parameters are within specification. Tool is released for front and backside alignment. From gsosa at snf.stanford.edu Thu May 3 15:59:41 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 3 May 2012 15:59:41 -0700 Subject: Comment asml SNF 2012-05-03 15:59:41: Front and backside align OK 5/3 Message-ID: ASML completed 3D align setup/calibrations. All 3D align parameters are within specification. Tool is released for front and backside alignment. From gsosa at snf.stanford.edu Thu May 3 15:59:58 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 3 May 2012 15:59:58 -0700 Subject: Problem asml SNF 2012-04-20 21:25:21: batch did not finish due to system error Message-ID: From gsosa at snf.stanford.edu Thu May 3 16:00:07 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 3 May 2012 16:00:07 -0700 Subject: Problem asml SNF 2012-04-20 17:11:23: Frontside align only 4/20 Message-ID: ASML completed 3D align setup/calibrations. All 3D align parameters are within specification. Tool is released for front and backside alignment. From gsosa at snf.stanford.edu Thu May 3 16:02:40 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 3 May 2012 16:02:40 -0700 Subject: Problem asml SNF 2012-05-03 16:02:39: No thick resist processing Message-ID: Do not expose thick resist (3.0 microns and above) until further notice. the purge/extraction hood has been removed and is out for repair. From bchui at snf.stanford.edu Thu May 3 17:36:19 2012 From: bchui at snf.stanford.edu (bchui at snf.stanford.edu) Date: Thu, 3 May 2012 17:36:19 -0700 Subject: Comment asml SNF 2012-05-03 17:36:19: Tried BSA -- largely fine, minor hiccups Message-ID: I tried the newly-restored BSA function this afternoon after Ping. I had 8 wafers with existing BSA marks, following a previously used ASML program. Of the 8 wafers, 5 went through fine. On the remaining 3, the machine would hiccup about 3/4 of the way through; the snag always occured on a left-most die (i.e. near the NW corner of the wafer). When that happened, I had to click "abort batch" and clear out the wafers and restart the remaining wafers. Before entering the machine, all 8 wafers passed the flatness 'float' test and were rinsed in the Litho SRD. Don't know if it's subtle differences in the wafers that caused the hiccups, or some of the settings on my program were too stringent, or was it some other factor. Thanks, Ben From insun at snf.stanford.edu Sun May 6 17:16:20 2012 From: insun at snf.stanford.edu (insun at snf.stanford.edu) Date: Sun, 6 May 2012 17:16:20 -0700 Subject: Problem asml SNF 2012-05-06 17:16:19: Message-ID: From ysohn at snf.stanford.edu Sun May 6 17:30:22 2012 From: ysohn at snf.stanford.edu (ysohn at snf.stanford.edu) Date: Sun, 6 May 2012 17:30:22 -0700 Subject: Problem asml SNF 2012-05-06 17:30:21: ASML software frozen Message-ID: While I was modifying job file, software froze. I tried to delete image distribution, and software stopped working. Except that window, other software worked normally, for example 'Mat Handle'. I took out all reticles and wafers from the machine. From vilanova at snf.stanford.edu Mon May 7 08:45:03 2012 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Mon, 7 May 2012 08:45:03 -0700 Subject: Problem asml SNF 2012-05-06 17:30:21: ASML software frozen Message-ID: Ran System Quals ,System wasnt Frozen When I Irrived, System Worked Fine, Exposed wafers, Zero Hotspots, Ready to use. From vilanova at snf.stanford.edu Mon May 7 08:46:11 2012 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Mon, 7 May 2012 08:46:11 -0700 Subject: Problem asml SNF 2012-05-06 17:16:19: Message-ID: Ran System Quals, Could Not Repeat User Error, System Working Fine, Zero Hotspots, Ready to use. From lindaohara at snf.stanford.edu Fri May 11 09:34:57 2012 From: lindaohara at snf.stanford.edu (lindaohara at snf.stanford.edu) Date: Fri, 11 May 2012 09:34:57 -0700 Subject: Comment asml SNF 2012-05-11 09:34:56: ASML Released Reservatins 10:00-14:00 Message-ID: From bchui at snf.stanford.edu Fri May 11 18:13:25 2012 From: bchui at snf.stanford.edu (bchui at snf.stanford.edu) Date: Fri, 11 May 2012 18:13:25 -0700 Subject: Shutdown asml SNF 2012-05-11 18:13:24: Wafer lost inside machine Message-ID: Was running a batch of 8 wafers, first 4 went fine. Error occurred on 5th wafer; machine says wafer lost. I have taken out the 4 completed wafers and 1 unexposed wafer, machine display shows only two wafers in system, should be 3. From gsosa at snf.stanford.edu Fri May 11 23:06:14 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Fri, 11 May 2012 23:06:14 -0700 Subject: Shutdown asml SNF 2012-05-11 18:13:24: Wafer lost inside machine Message-ID: Removed the wafers stranded in the tool. Re-initialized tool and tested wafrer handling with dummy job. Cleaned the e-chuck and verified with hotspot test-OK. Wafers are quarantined until further investigation is done. Please do not run anymore wafers from this lot over the weekend From gsosa at snf.stanford.edu Tue May 22 15:41:22 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Tue, 22 May 2012 15:41:22 -0700 Subject: Problem asml SNF 2012-05-22 15:41:22: Shutdown 5/22 Message-ID: The stepper will be shutdown overning due to critical metrology setups in progress. The tool is in an uncalibrated state and not ready for wafer processing. ASNL vendors will continue with setups tomorrow(5/23). From gsosa at snf.stanford.edu Tue May 22 15:42:19 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Tue, 22 May 2012 15:42:19 -0700 Subject: Shutdown asml SNF 2012-05-22 15:42:18: Shutdown 5/22 Message-ID: The stepper will be shutdown overning due to critical metrology setups in progress. The tool is in an uncalibrated state and not ready for wafer processing. ASML vendors will continue with setups tomorrow(5/23). From gsosa at snf.stanford.edu Wed May 23 16:10:08 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Wed, 23 May 2012 16:10:08 -0700 Subject: Shutdown asml SNF 2012-05-23 16:10:07: Shutdown 5/23 Message-ID: The stepper is still shut down. The ASML vendors are doing some critical setups to the alignmnet system. They will need to bring in some additional tooling to adjust the reticle table tilt. Stepper is not in a working state. ASML to continue work tomorrow. From pding at snf.stanford.edu Thu May 24 14:54:10 2012 From: pding at snf.stanford.edu (pding at snf.stanford.edu) Date: Thu, 24 May 2012 14:54:10 -0700 Subject: Shutdown asml SNF 2012-05-22 15:42:18: Shutdown 5/22 Message-ID: Front side is up From pding at snf.stanford.edu Thu May 24 14:54:25 2012 From: pding at snf.stanford.edu (pding at snf.stanford.edu) Date: Thu, 24 May 2012 14:54:25 -0700 Subject: Shutdown asml SNF 2012-05-23 16:10:07: Shutdown 5/23 Message-ID: frontside is up From pding at snf.stanford.edu Thu May 24 14:54:51 2012 From: pding at snf.stanford.edu (pding at snf.stanford.edu) Date: Thu, 24 May 2012 14:54:51 -0700 Subject: Problem asml SNF 2012-05-22 15:41:22: Shutdown 5/22 Message-ID: PM completed From pding at snf.stanford.edu Thu May 24 14:55:39 2012 From: pding at snf.stanford.edu (pding at snf.stanford.edu) Date: Thu, 24 May 2012 14:55:39 -0700 Subject: Problem asml SNF 2012-05-24 14:55:38: Backside is not up yet Message-ID: Frontside is up but no backside alignment yet From pding at snf.stanford.edu Fri May 25 12:45:19 2012 From: pding at snf.stanford.edu (pding at snf.stanford.edu) Date: Fri, 25 May 2012 12:45:19 -0700 Subject: Problem asml SNF 2012-05-24 14:55:38: Backside is not up yet Message-ID: BSA is up and in spec From pding at snf.stanford.edu Fri May 25 12:46:33 2012 From: pding at snf.stanford.edu (pding at snf.stanford.edu) Date: Fri, 25 May 2012 12:46:33 -0700 Subject: Comment asml SNF 2012-05-25 12:46:33: 3DAlign is up Message-ID: Backside alignment has been calibrated and is in spec. Good for use. From gsosa at snf.stanford.edu Fri May 25 17:41:49 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Fri, 25 May 2012 17:41:49 -0700 Subject: Problem asml SNF 2012-05-25 17:41:48: Leveling problem 5/25 Message-ID: From gsosa at snf.stanford.edu Fri May 25 17:43:35 2012 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Fri, 25 May 2012 17:43:35 -0700 Subject: Problem asml SNF 2012-05-25 17:41:48: Leveling problem 5/25 Message-ID: Had to reset the wafer stage rack and LC rack and did a fresh unix restart. Cleaned the E-chuck and checked with hotspot test- OK. Cycled wafers through the tool - All OK. From vilanova at snf.stanford.edu Tue May 29 09:50:52 2012 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Tue, 29 May 2012 09:50:52 -0700 Subject: Comment asml SNF 2012-05-29 09:50:51: Hotspot Found On Lower right hand corner Message-ID: Hotspot Found On Lower Right Hand Corner, Cleaned chuck, tested All operations Ok, Good To use. From lindaohara at snf.stanford.edu Wed May 30 09:58:47 2012 From: lindaohara at snf.stanford.edu (lindaohara at snf.stanford.edu) Date: Wed, 30 May 2012 09:58:47 -0700 Subject: Comment asml SNF 2012-05-30 09:58:46: ASML Released Reservations 11:00-14:00 Message-ID: From lindaohara at snf.stanford.edu Thu May 31 11:36:50 2012 From: lindaohara at snf.stanford.edu (lindaohara at snf.stanford.edu) Date: Thu, 31 May 2012 11:36:50 -0700 Subject: Comment asml SNF 2012-05-31 11:36:49: ASML Released Reservations 12:00-14:00 Message-ID: