Shutdown asml SNF 2012-05-03 09:28:38: Shutdown 5/3

gsosa at snf.stanford.edu gsosa at snf.stanford.edu
Thu May 3 12:33:56 PDT 2012


No problem found. User found out from company that the scrateches to the right of the major flat were from prior processing. What appears to be scratches near the center portion of the wafer are most likely poor spin. As a precaution 5 resist coated wafers wee processed through the tool using normal batch operations. This was repeated 10 times, inspecting the wafers in between every batch cycle for a total of 50 wafer transfers. No scratches were observed. An additional 50 wafer transfers were done using the test manager(multi-batch cycling. Also, no scratches were observed. System is OK. ASML to continue with 3D align setup.




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