thick resist

Xuan Wu xuanwu at
Tue Jun 5 14:05:19 PDT 2012

Hi fellow ASML users,

I'm looking to do DRIE almost through my wafer, so I need a pretty thick 
mask.  I had originally wanted to use 7 um resist, but the maintenance 
record shows that because of the removal of the purge/extraction hood, 
no resists 3.0 um or above are allowed.  Because of front-side features, 
I cannot put down more oxide than what I already have.  Does anyone have 
experience doing this kind of stuff after the hood removal, or have any 
suggestions for workarounds?

My oxide is thermal and 600nm thick.

Thanks in advance,

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