From jaypark at stanford.edu Mon Sep 3 11:48:38 2012 From: jaypark at stanford.edu (Jason Parker) Date: Mon, 3 Sep 2012 11:48:38 -0700 (PDT) Subject: [Asml] Tue 2pm-3pm released In-Reply-To: <1759893898.93821422.1346698089569.JavaMail.root@zm08.stanford.edu> Message-ID: <500091960.93821470.1346698118912.JavaMail.root@zm08.stanford.edu> ASML reservation for Tuesday, Sept 4, 2pm-3pm released. Jason From mahnaz at stanford.edu Wed Sep 12 16:02:28 2012 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Wed, 12 Sep 2012 16:02:28 -0700 Subject: Purge hood Message-ID: <50511484.4050502@stanford.edu> Hello all, The purge hood has been installed if for any reason you get any kind of error on the system do not attempt to do anything. *Do not try to retrieve your wafers or to initialize the system just shut down the tool.* We encounter an issue yesterday afternoon and if we had tried to move things in the system we would have caused serious damage. On the positive note, we can start using the stepper to expose 220-7. Litho team -------------- next part -------------- An HTML attachment was scrubbed... URL: From gsosa at stanford.edu Thu Sep 13 15:41:34 2012 From: gsosa at stanford.edu (Gary J Sosa) Date: Thu, 13 Sep 2012 15:41:34 -0700 (PDT) Subject: Urgent- Updated Stepper Status 9/13- Please Read!!!! In-Reply-To: <6605831a-a1db-45d8-8295-1652a9c91580@Gary-PC> Message-ID: Hello Stepper Users. There is a wafer loading repeatability problem that needs to be diagnosed and repaired by ASML. UNTIL FURTHER NOTICE, DO NOT EXPOSE ANY ZERO LAYERS OR USE 3D ALIGNMENT UNTIL ASML RESOLVES THE ISSUES. ASML F/S will be back in tomorrow morning to work on the problem. Thank you in advance for you patience and understanding. Regards... Gary -------------- next part -------------- An HTML attachment was scrubbed... URL: From gsosa at stanford.edu Fri Sep 14 16:09:30 2012 From: gsosa at stanford.edu (Gary J Sosa) Date: Fri, 14 Sep 2012 16:09:30 -0700 (PDT) Subject: Urgent Stepper Update- Please Read 9/14 In-Reply-To: <2069288894.202424248.1347662096780.JavaMail.root@zm08.stanford.edu> Message-ID: Hello Stepper Users Do not expose thick resist (3.0 microns and above) until further notice. Do not use 3D alignment system. 3D align will be calibrated next Tuesday(9/18) The purge/extraction hood was removed from the system again. There is some unusual problem with the hood that we do not understand yet, that is causing contamination and damage to the optical surfaces on the wafer table and fiducial plates. To avoid any further damage, it was decided by ASML to remove the purge hood. The system is released for frontside align only, including zero layer. The system is not available for thick resist processing and 3D align. The 3D alignment system will be calibrated next Tuesday( 9/18) Thanks... The Litho Team From jaypark at stanford.edu Wed Sep 19 09:29:38 2012 From: jaypark at stanford.edu (Jason Parker) Date: Wed, 19 Sep 2012 09:29:38 -0700 (PDT) Subject: [Asml] Process for shooting marks and features together In-Reply-To: Message-ID: <747795031.206694534.1348072178632.JavaMail.root@zm08.stanford.edu> ASML users, Some users have processes that can benefit from exposing their zero and first layers together. The litho team has put together a way to provide this capability to you. Notes: -If you don't know you need this, then you probably don't and you're safest (regarding process robustness) continuing to not process your zero and first layers together. -There are severe alignment and mark processing limitations to this that you must understand (see linked info). Setting up and using this process is documented here: "https://snf.stanford.edu/SNF/equipment/optical-photolithography/exposure/asml/snf-utility-mask" All users considering using this process please plan on supplying the "request form" linked near the bottom of the website. -Litho team