From gyama at snf.stanford.edu  Fri Apr 10 11:36:16 2009
From: gyama at snf.stanford.edu (gyama at snf.stanford.edu)
Date: Fri, 10 Apr 2009 11:36:16 -0700
Subject: Comment cmp SNF 2009-04-10 11:36:16: clean non-metal pad changed
Message-ID: <mailman.71.1356281226.3503.cmp-pcs@snf.stanford.edu>




From filip at snf.stanford.edu  Fri Apr 10 13:32:43 2009
From: filip at snf.stanford.edu (filip at snf.stanford.edu)
Date: Fri, 10 Apr 2009 13:32:43 -0700
Subject: Problem cmp SNF 2009-04-10 13:32:42: broken wafers
Message-ID: <mailman.72.1356281226.3503.cmp-pcs@snf.stanford.edu>

broke 4 out of 8 wafers during chucking. This may be my inexperience, but the membrane bulged out, and then after pressing 'chucking' button vacuum pulls the wafer in, and any slight misalignment of the wafer from the ring caused a crack. 



From emyers at snf.stanford.edu  Fri Apr 10 13:43:13 2009
From: emyers at snf.stanford.edu (emyers at snf.stanford.edu)
Date: Fri, 10 Apr 2009 13:43:13 -0700
Subject: Comment cmp SNF 2009-04-10 13:43:12: Asked GnP for Help
Message-ID: <mailman.73.1356281226.3503.cmp-pcs@snf.stanford.edu>

All.  I have sent a few of your email comments to GnP asking for assistance and comments.  In the past they have responded quickly and helpfully.  I will update you on what I hear.  Ed