Problem cmp SNF 2012-06-08 15:59:44: previous user did

gyama at snf.stanford.edu gyama at snf.stanford.edu
Fri Jun 8 15:59:44 PDT 2012


1) not wipe off membrane, dried slurry on black rubber, need to rinse & wipe dry
2) pressure regulator is now mounted on the back of the tool.  Lower
regulator not functional. Need to look through the left side window to 
see pressure now
3) 30/50RPM. 200/300pressure, gold tooling, new retainer ring /
membrane assembly, S-10 slurry, 60s polish took off >800A thermal ox
4) new retainer ring ~0.5-1.0mm thicker than 550um wafer.  It should
 be 66-100% of wafer thickness to allow polishing out to the edge of the wafer.  Does vendor have different thickness of retainer ring, or can this one be sent out to the machine shop for thinning?




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