Fwd: Re: CMP tool

Li-Wen Chang lwchang at stanford.edu
Wed Mar 5 11:18:36 PST 2008


Hi Gary, Ed and CMP users,
I need to polish Pt deposited by an outside vendor and will go back to
metalica for the final step.

Li-Wen


On Wed, Mar 5, 2008 at 8:29 AM, Gary Yama (SNF) <gyama at snf.stanford.edu> wrote:
> can I get a list of materials all CMP users are doing and if they need
> to go back into clean, semi-clean or dirty tools in the fab.  i'll compile.
>
> seems like the metal set is alreagy gold contaminated.
>
> do the Ge or LTO folks need to go back into clean or semi clean tools?
>
> if you are all OK with KOH decontam after clean metals CMP, then going
> back into CMOS clean tools, then convert the non-metal set for clean
> metal.
>
> if that is a problem, then we'll have to see who has the most urgent
> need until the new set arrives.
>
> Gary
>
> Ed Myers wrote:
>
> > Paul and Gary,
> >
> > I looked over my emails regarding CMP wafer categories.  If we
> > dedicate one set of consumables to Li-Wen or more generally gold
> > contaminated, we won't have a set for the following requests.  We have
> > a users doing Ge polishing and users doing LTO polishing.  These two
> > applications cover the Semi-clean group.
> >
> > By following the pathway, we will have a set for clean (metal or
> > non-metal), semi-clean (metal or non-metal) and gold contaminated
> > (everything).
> >
> > Will this be satisfactory for everyone?  I think we will have some
> > resistance to people going back in to epi, or similar tools after
> > polishing of wafers which may have Al, Ti or W on them.
> >
> > Ed
> >
> >
> > At 10:13 AM 2/29/2008, you wrote:
> >
> >> Hi Ed,
> >>
> >> Were you able to set up anything with Li-Wen?
> >>
> >> Paul
> >>
> >>> X-Sieve: CMU Sieve 2.3
> >>> X-Mailer: QUALCOMM Windows Eudora Version 6.2.5.6
> >>> Date: Thu, 28 Feb 2008 09:26:51 -0800
> >>> To: Paul Rissman <rissman at stanford.edu>
> >>> From: "H.-S. Philip Wong" <hspwong at stanford.edu>
> >>> Subject: Fwd: Re: CMP tool
> >>>
> >>> Paul,
> >>>
> >>> Would you please make sure Ed look into this so Li-Wen Chang can
> >>> start doing process development? I paid for part of the capital cost
> >>> of the tool and I also proposed (and supported) the Intel grant for
> >>> the brush cleaner for the CMP tool. My usage of the tool has always
> >>> been "non-clean" (and I have made this clear up front before the
> >>> tool was purchased). So it does not really make sense that now I
> >>> cannot use the tool.
> >>>
> >>>> Date: Wed, 27 Feb 2008 11:45:59 -0800
> >>>> To: Ed Myers <edmyers at stanford.edu>
> >>>> From: "H.-S. Philip Wong" <hspwong at stanford.edu>
> >>>> Subject: Re: CMP tool
> >>>>
> >>>> Ed,
> >>>>
> >>>> Thank you for the update. Please keep following up on the order. I
> >>>> am wondering if there is anything we can do in the meantime to get
> >>>> Li-Wen on the tool so she can start developing the process? Is the
> >>>> issue the platten or just the polishing pads? I am happy to pay for
> >>>> extra polishing pads if that means we need to pull out pads more
> >>>> often in the mean time.
> >>>>
> >>>> Somehow I was not involved when the tool first got started (even
> >>>> though I paid for part of the tool) and how it was decided that the
> >>>> tool will be a clean tool. Before I put down the money, I have told
> >>>> everyone (Roger Howe, Tom Kenny, Paul Rissman) that my needs are
> >>>> non-clean polishing. That's why you see SangBum Kim polishing Au
> >>>> contaminated oxides (with nanowires on them). And therefore I was a
> >>>> bit surprised when I heard that the tool was only for clean samples
> >>>> (and thus my inquiry).
> >>>>
> >>>> In any case, I am glad that this is being resolved and we can
> >>>> accommodate everyone. Thanks!
> >>>>
> >>>> Philip
> >>>>
> >>>> At 08:00 AM 2/27/2008, you wrote:
> >>>>
> >>>>> Philip,
> >>>>>
> >>>>> When we purchased the tool I foresaw two categories, clean and
> >>>>> gold contaminated.  I purchased two sets of consumables with the
> >>>>> initial order to cover these applications.  Once it arrive, the
> >>>>> consensus  (Bosch driven) was to use the two sets for clean
> >>>>> non-metal and clean metal.  This original set-up was taking care
> >>>>> of 99% of the users.  Over the past month about 75% of the lab
> >>>>> members are requesting polishing of heavily gold contaminated
> >>>>> samples.  As a result I have placed an order for a third set of
> >>>>> consumables ($13k) and Bosch has order another patten to protect
> >>>>> their interest.  Li-Wen is caught because of our slow reaction to
> >>>>> the changing dynamics of the lab member request and my intention
> >>>>> to group the consumable order with the purchase of the post-CMP
> >>>>> clean tool.  We received funding from the Intel Educational Grant
> >>>>> for this tool.  There is some extra money in the grant for
> >>>>> supporting the CMP infrastructure.  However the University won't
> >>>>> deposit the check we received in November. As a result I have
> >>>>> written a PO against the SNF account.  The PO for the 3rd
> >>>>> consumable kit is in the signature/PO loop.  I will contact the
> >>>>> manufacture and see if they can ship the parts quickly when they
> >>>>> receive the PO.
> >>>>>
> >>>>> I will also talk with Li-Wen and review her samples to see if we
> >>>>> can find a way to get them polished.
> >>>>>
> >>>>> Regards,
> >>>>> Ed
> >>>>>
> >>>>> At 09:26 PM 2/26/2008, H.-S. Philip Wong wrote:
> >>>>>
> >>>>>> Ed,
> >>>>>>
> >>>>>> Can you fill me in on this? I believe Li-Wen has been planning on
> >>>>>> doing polishing for metals and she has been talking to you about it.
> >>>>>>
> >>>>>> I don't understand what she means by "the CMP is clean process."
> >>>>>> My other student, SangBum Kim, has been polishing nanowire wafers
> >>>>>> using the CMP tool. Also, I paid for part of the tool and one of
> >>>>>> the condition of my chipping in money is that I can use it to
> >>>>>> polish non-clean wafers. What has changed?
> >>>>>>
> >>>>>> Why did it take so long to get the polishing materials for metal?
> >>>>>>
> >>>>>> We need to polish the whole wafer to get uniform polishing.
> >>>>>> Polishing in the crystal shop is not adequate.
> >>>>>>
> >>>>>> At 09:13 PM 2/26/2008, Li-Wen Chang wrote:
> >>>>>>
> >>>>>>> Yes.
> >>>>>>> Just to let you know, I've submit a SU-13 for CMP in crystal shop.
> >>>>>>> The one at snf is for clean process. Ed ordered another
> >>>>>>> supplement for
> >>>>>>> metal process but will probably take months to arrive.
> >>>>>>> So I'll start with crystal shop for now.
> >>>>>>>
> >>>>>>> And I'll be at SPIE on Thursday so will miss the group meeting.
> >>>>>>>
> >>>>>>> Li-Wen
> >>>>>>
> >>>>>>
> >>>>>> Philip
> >>>>>>
> >>>>>> H.-S. Philip Wong
> >>>>>> Center for Integrated Systems, CISX 312
> >>>>>> 420 Via Palou,
> >>>>>> Stanford University, Stanford, CA 94305.
> >>>>>> Phone: +1-650-725-0982
> >>>>>> Fax: +1-650-725-7731
> >>>>>> Mobile: +1-650-353-0796
> >>>>>> Email: hspwong at stanford.edu
> >>>>>
> >>>> Philip
> >>>>
> >>>> H.-S. Philip Wong
> >>>> Center for Integrated Systems, CISX 312
> >>>> 420 Via Palou,
> >>>> Stanford University, Stanford, CA 94305.
> >>>> Phone: +1-650-725-0982
> >>>> Fax: +1-650-725-7731
> >>>> Mobile: +1-650-353-0796
> >>>> Email: hspwong at stanford.edu
> >>>
> >>>
> >>> Philip
> >>>
> >>> H.-S. Philip Wong
> >>> Center for Integrated Systems, CISX 312
> >>> 420 Via Palou,
> >>> Stanford University, Stanford, CA 94305.
> >>> Phone: +1-650-725-0982
> >>> Fax: +1-650-725-7731
> >>> Mobile: +1-650-353-0796
> >>> Email: hspwong at stanford.edu
> >>
> >
> >
>



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