Stanford Wafer chucking after polishing is breaking wafers.

[Gary Yama (SNF)]

Was Sungmin planning to come in today?

Please let me know - Gary

Hyoungjae Kim wrote:

> Dear Gary
>
> We are sorry for the problem. It seems that the problem is caused by a
> sensor which detects the position of head.
>
> I made adjustment method and please check the attached file for the
> adjustment of the sensor location.
>
> Also, Sungmin will visit SNF when you are available.
>
> Thank you
>
> Hyoungjae
>
>
>
>
>     ---------- Original Message ----------
>     *From:* "Gary Yama (SNF)" <gyama at snf.stanford.edu>
>     *Date:* 2008-03-12 07:44:33
>     *Subject:* Re: Stanford Wafer chucking after polishing is breaking
>     wafers.
>     *To:* lganey at apsinc-us.com,
>
>
>     We are having problems with the platen stopping when head 1 comes
>     down &
>     starts to polish. We had this problem when we switched to the new
>     style
>     head.
>
>     Can your guy from Berkeley come & take a look at it? We have a user
>     that needs to get their wafers through. Please let me know at your
>     earliest convenience.
>
>     Best regards,
>
>     Gary
>
>     Lee Ganey wrote:
>
>     >Hello Ed,
>     >
>     >Will do. I'll follow up shortly.
>     >
>     >Thanks, Lee
>     >
>     >
>     >-----Original Message-----
>     >From: Ed Myers [mailto:edmyers at stanford.edu]
>     >Sent: Monday, March 03, 2008 1:02 PM
>     >To: Lee Ganey
>     >Cc: Kim Hyoungjae ; Hyoungjae Kim; Ho Young Kim; Gary Yama (SNF)
>     >Subject: Stanford Wafer chucking after polishing is breaking wafers.
>     >
>     >Lee,
>     >
>     >I have a couple of items related to our CMP tool.
>     >
>     >1) I have submitted a PO for a new 4" wafer chuck, diamond
>     >conditioner, diamond inserts and a platen per your quote. Could you
>     >please try and get these on the GnP manufacturing schedule. The PO
>     >was submitted a week ago, which means maybe the middle of this month
>     >you will get notification. I have an upset faculty member who I'm
>     >trying to hold off until I get this set of consumables. Anything you
>     >can do to pull in the delivery will be appreciated.
>     >
>     >2) The second is still about chucking. Sometimes the chucks are able
>     >to pull vacuum on the wafer and other times not. As you can see
>     >below, a suggested work around isn't working. The few times I've ran
>     >the tool recently, I used the Auto programs and did not have a
>     problem.
>     >
>     >Thanks,
>     >Ed
>     >
>     >
>     >
>     >
>     >
>     >
>     >>Dear Gary, Ed and cmp users,
>     >>
>     >> I was polishing my PECVD oxide and nitride wafers today and I
>     >>broke all of them while CMPing. The problem seems to be chucking
>     >>when I raise the head1 up after I am done with the polishing. (As
>     >>Gary suggested, I manually ran my wafers.) I know they got broken
>     >>when it was chucking because there is no wafer piece on the pad
>     >>after polishing other than the area below the head1.
>     >>
>     >> Do you have any suggestions to prevent this from happening again?
>     >>
>     >>1) Is it possible to make the vacuum weaker for chucking?
>     >>2) Can I turn off the vacuum pump before I raise the head1 so
>     >>that it would not chuck the wafer (and break it)?
>     >>
>     >> Also, I will remove my waste carboys on Monday.
>     >>
>     >>Thanks,
>     >>
>     >>
>     >>
>     >
>     >
>     >
>     >
>     >
>