recommended new settings
Gary Yama (SNF)
gyama at snf.stanford.edu
Wed Mar 19 15:44:55 PDT 2008
The engineer was in to fix the tool, looks like the dirty metal head1
was used too long & the retainer ring was worn out. New one installed &
SUBA 500 pad on non-metal platen, conditioned with water 10 min, 2x.
Engineer also said to soak head1 in water when not using, but called
today & said NOT to soak the head1 in wafer. Just clean all the slurry
off the black diaphragm throughly. Clean off the slurry on head2 with
toothbrush & water. Do not let slurry dry on head 2.
Head2: same 60RPM
Polishing pressure: 200gm/cm2
Retainer pressure: 300gm/cm2
This will lower the polishing rate & should good for those doing thin films.
Looking into stiff pad for Si & Ox topology wafers.
More information about the cmp