From roberth at quswami.com Thu Feb 3 23:27:47 2011 From: roberth at quswami.com (Robert Huang) Date: Thu, 3 Feb 2011 23:27:47 -0800 Subject: post-CMP clean... Message-ID: <3F24868DDBDC7B46B2289E33B58C4CB1220B88A281@QUSWAMI-DSRV1.quswami.local> Fellow CMP'ers: Have any of you looked at any other post-CMP cleans? I have been going the manual route using DI water rinse at the wetbench next to the tool, brush scrub with the sponge (front and back-sides of the wafer), back to DI rinse, then N2 dry. I then follow the standard KOH decontamination at wbsilicide. However, when I do AFM after all this, I still see indications of slurry particles on my wafers. I'm also concerned about any other residue, including metallics, that may still be on my wafers. If any of you have tried other post-CMP cleans, I'd be very interested to hear your results and experiences. In addition, has anyone ever tried the automated clean tool to the right of the tool? Regards, Robert -------------- next part -------------- An HTML attachment was scrubbed... URL: From edmyers at stanford.edu Fri Feb 4 10:15:51 2011 From: edmyers at stanford.edu (Ed Myers) Date: Fri, 04 Feb 2011 10:15:51 -0800 Subject: post-CMP clean... In-Reply-To: <3F24868DDBDC7B46B2289E33B58C4CB1220B88A281@QUSWAMI-DSRV1.q uswami.local> References: <3F24868DDBDC7B46B2289E33B58C4CB1220B88A281@QUSWAMI-DSRV1.quswami.local> Message-ID: <6.2.5.6.2.20110204100823.051f88f8@stanford.edu> All, The Post-CMP scrubber next to the system has only been used a few times. We did have one company which ran several groups of wafers through the system with favorable results. These wafers had not been CMP'ed but had particulate problems from one of their other processes (outside of the SNF). What we did find during that time was the quality of the clean was heavily depending on the conditioning of the brushes. They were using the dirty brushes which reside in the system. If we did not take them out and soak them for a day the process added scratches from local dry spots on the brush. The most successful results I have heard, the lab members would keep their wafers wet. They would do the wet bench scrub described by Robert, but would place the wafers in to a water bucket and transport the wafers to the decontamination bench. This works for many samples but not all (Al is etched in DI water). When the scrub track was purchased I looked for a combination cleaner with a megasonic's module. They are out there, but not within our price limitations. Regards, Ed At 11:27 PM 2/3/2011, you wrote: >Fellow CMP'ers: > >Have any of you looked at any other post-CMP cleans? I have been >going the manual route using DI water rinse at the wetbench next to >the tool, brush scrub with the sponge (front and back-sides of the >wafer), back to DI rinse, then N2 dry. I then follow the standard >KOH decontamination at wbsilicide. However, when I do AFM after all >this, I still see indications of slurry particles on my wafers. I'm >also concerned about any other residue, including metallics, that >may still be on my wafers. If any of you have tried other post-CMP >cleans, I'd be very interested to hear your results and >experiences. In addition, has anyone ever tried the automated clean >tool to the right of the tool? > >Regards, > >Robert