From edmyers at stanford.edu  Mon Jun  6 11:18:28 2011
From: edmyers at stanford.edu (Ed Myers)
Date: Mon, 06 Jun 2011 11:18:28 -0700
Subject: Fwd: Problem cmp SNF 2011-06-06 11:17:39: Gold HW set Problem
Message-ID: <6.2.5.6.2.20110606111820.05b1e870@stanford.edu>


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>Subject: Problem cmp SNF 2011-06-06 11:17:39: Gold HW set Problem
>Date: Mon, 6 Jun 2011 11:17:39 -0700
>From: emyers at snf.stanford.edu
>To: cmp-pcs at snf.stanford.edu
>
>It has been reported the Gold Hardware set is not polishing.  A lab 
>member reports there is no material removal.  This problem is 
>related to the gold hardware set, but should not effect the other 
>hardware sets.  I do not know if the Gold HW set problems is related 
>to the new membrane or the set up following the HW change.




From edmyers at stanford.edu  Tue Jun 21 16:22:20 2011
From: edmyers at stanford.edu (Ed Myers)
Date: Tue, 21 Jun 2011 16:22:20 -0700
Subject: CMP Challenges
Message-ID: <6.2.5.6.2.20110621161426.05c6e5d8@stanford.edu>

All,

Over the years I would get occasional reports of polishing rate 
asperities.  This may happen more than I'm aware, since often times 
problems or concerns go unreported.  During these isolated 
excursions, I was never able to find any correlate to these problems.

Recently I have changed out a number of our membranes within a sort 
time period.  This has resulted in many more reports of polishing 
problems.  I feel pretty confident there is a correlation to our 
membrane assemblies and our polishing rate excursions.  I am working 
with the US parts supplier and GnP to understand why we are so 
sensitive to the changing of the membranes.  We are trying to 
determine if we received incorrect assemblies, if there is a way to 
condition the assemblies or if we need to modernize our wafer heads.

I will keep you appraised to any findings or developments as they become clear.

Regards,
Ed



From edmyers at stanford.edu  Mon Jun 27 19:34:52 2011
From: edmyers at stanford.edu (Ed Myers)
Date: Mon, 27 Jun 2011 19:34:52 -0700
Subject: Fwd: CMP Challenges
Message-ID: <6.2.5.6.2.20110627192820.05c34d48@stanford.edu>

All,

I want to be more clear about what is going on with the CMP.  Right 
now the gold contaminated hardware set is not working.  This was 
reported by a lab member who found a zero polishing rate for this 
hardware set.  It has also been reported that the clean non-metal 
also has a low polishing rate.

I believe these problems related to the membrane assembly.  Recently 
I purchase membranes from the US distributor.  These membranes do not 
work with our hardware.  Apparently we have an older version of 
hardware, which caused the confusion.  I am working with the vendor 
to get the correct membranes, but I'm afraid they will have to be 
shipped from overseas.

In the mean time, I am also trying to address the polish rate 
variations between new and used membrane assemblies.

Regards,
Ed

>Date: Tue, 21 Jun 2011 16:22:20 -0700
>To: cmp at snf.stanford.edu
>From: Ed Myers <edmyers at stanford.edu>
>Subject: CMP Challenges
>
>All,
>
>Over the years I would get occasional reports of polishing rate 
>asperities.  This may happen more than I'm aware, since often times 
>problems or concerns go unreported.  During these isolated 
>excursions, I was never able to find any correlate to these problems.
>
>Recently I have changed out a number of our membranes within a sort 
>time period.  This has resulted in many more reports of polishing 
>problems.  I feel pretty confident there is a correlation to our 
>membrane assemblies and our polishing rate excursions.  I am working 
>with the US parts supplier and GnP to understand why we are so 
>sensitive to the changing of the membranes.  We are trying to 
>determine if we received incorrect assemblies, if there is a way to 
>condition the assemblies or if we need to modernize our wafer heads.
>
>I will keep you appraised to any findings or developments as they 
>become clear.
>
>Regards,
>Ed




From chienyuc at stanford.edu  Mon Jun 27 20:27:17 2011
From: chienyuc at stanford.edu (Chien-Yu Chen)
Date: Mon, 27 Jun 2011 20:27:17 -0700 (PDT)
Subject: CMP Challenges
In-Reply-To: <6.2.5.6.2.20110627192820.05c34d48@stanford.edu>
Message-ID: <1224839843.277372.1309231637348.JavaMail.root@zm03.stanford.edu>

Hi Ed,

I have no idea about how the membrane issue will affect the results, but I can share my recent polish rate of Epi2 Ge and LTO300PC at clean metal head sets: planar Ge is about 25-30nm/min and LTO is about 70nm/min, which are both pretty much the same as Filip tested long time ago.  If any noticeable membrane difference occurs only in gold/nonmetal heads we may conclude there is some problem, although I would prefer the pad grooves dominate the polishing rate.

Hope that helps,
Chien-Yu
----- Original Message -----
From: "Ed Myers" <edmyers at stanford.edu>
To: cmp at snf.stanford.edu
Sent: 2011?6?27? ??? 19:34:52
Subject: Fwd: CMP Challenges

All,

I want to be more clear about what is going on with the CMP.  Right 
now the gold contaminated hardware set is not working.  This was 
reported by a lab member who found a zero polishing rate for this 
hardware set.  It has also been reported that the clean non-metal 
also has a low polishing rate.

I believe these problems related to the membrane assembly.  Recently 
I purchase membranes from the US distributor.  These membranes do not 
work with our hardware.  Apparently we have an older version of 
hardware, which caused the confusion.  I am working with the vendor 
to get the correct membranes, but I'm afraid they will have to be 
shipped from overseas.

In the mean time, I am also trying to address the polish rate 
variations between new and used membrane assemblies.

Regards,
Ed

>Date: Tue, 21 Jun 2011 16:22:20 -0700
>To: cmp at snf.stanford.edu
>From: Ed Myers <edmyers at stanford.edu>
>Subject: CMP Challenges
>
>All,
>
>Over the years I would get occasional reports of polishing rate 
>asperities.  This may happen more than I'm aware, since often times 
>problems or concerns go unreported.  During these isolated 
>excursions, I was never able to find any correlate to these problems.
>
>Recently I have changed out a number of our membranes within a sort 
>time period.  This has resulted in many more reports of polishing 
>problems.  I feel pretty confident there is a correlation to our 
>membrane assemblies and our polishing rate excursions.  I am working 
>with the US parts supplier and GnP to understand why we are so 
>sensitive to the changing of the membranes.  We are trying to 
>determine if we received incorrect assemblies, if there is a way to 
>condition the assemblies or if we need to modernize our wafer heads.
>
>I will keep you appraised to any findings or developments as they 
>become clear.
>
>Regards,
>Ed