From edmyers at stanford.edu Mon Jun 4 16:16:42 2012 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 04 Jun 2012 16:16:42 -0700 Subject: CMP is UP Message-ID: <4FCD41DA.4000504@stanford.edu> All, I have green lighted the CMP system. The re-manufactured heads have arrived and we have a new pressure regulator installed. As far as I know everything should be working. I do see that the new membrane is much more stretchable than the old style. Please do not over inflate the membrane during the dechucking process. Also please make sure you do not leave it in the inflated condition when you have completed your work. Currently the Gold Contaminated hardware set is installed. Regard, SNF Staff From gyama.snf at gmail.com Fri Jun 8 16:00:52 2012 From: gyama.snf at gmail.com (Gary Yama - SNF) Date: Fri, 8 Jun 2012 16:00:52 -0700 Subject: CMP update, 6/8/2012 Message-ID: 1) Pressure regulator is now mounted on the back of the tool. Lower regulator not functional. Need to look through the left side window to see pressure now. 2) 30/50RPM. 200/300pressure, gold tooling, new retainer ring/membrane assembly, S-10 slurry, 60s polish took off >800A thermal ox. Seems faster. Leaving ~5mm non-polished edge due to thicker retainer ring. 3) New retainer ring is ~0.5-1.0mm thicker than 550um wafer. It should be 66-100% of wafer thickness to allow polishing out to the edge of the wafer. Does vendor have a different thickness of retainer ring, or can this one be sent out to the machine shop for thinning? Let me know if you have any other questions from this brief test. Gary From edmyers at stanford.edu Fri Jun 8 17:20:22 2012 From: edmyers at stanford.edu (Ed Myers) Date: Fri, 08 Jun 2012 17:20:22 -0700 Subject: CMP update, 6/8/2012 In-Reply-To: References: Message-ID: <4FD296C6.2@stanford.edu> Gary, 1) Yes, the old regulator was not removed. It appears that it was mounted on the frame prior to the system assembly. It's not in an easy place to access and it's mounted to a critical component. It would be nice to get it removed, but it's a bigger project than it should be. 2) Oxide polishing has been around 12 Ang/sec according to all of Chris McGuinness work. This spans a number of years of effort. I think the rate is OK. 3) I would be very hesitant at modifying the retainer ring. The new membrane is very flexible compared to the old head design. The retainer ring is mainly for confinement of the wafer and the inner ram is what creates the force on the wafer. With the new, stretchable membrane the inner ram should be able to extend much farther. I can test this on the bench. Regards, Ed On 6/8/2012 4:00 PM, Gary Yama - SNF wrote: > 1) Pressure regulator is now mounted on the back of the tool. Lower > regulator not functional. Need to look through the left side window to > see pressure now. > > 2) 30/50RPM. 200/300pressure, gold tooling, new retainer ring/membrane > assembly, S-10 slurry, 60s polish took off>800A thermal ox. Seems > faster. Leaving ~5mm non-polished edge due to thicker retainer ring. > > 3) New retainer ring is ~0.5-1.0mm thicker than 550um wafer. It > should be 66-100% of wafer thickness to allow polishing out to the > edge of the wafer. Does vendor have a different thickness of retainer > ring, or can this one be sent out to the machine shop for thinning? > > Let me know if you have any other questions from this brief test. > > Gary >