CMP update, 6/8/2012

Gary Yama - SNF gyama.snf at
Fri Jun 8 16:00:52 PDT 2012

1) Pressure regulator is now mounted on the back of the tool.  Lower
regulator not functional. Need to look through the left side window to
see pressure now.

2) 30/50RPM. 200/300pressure, gold tooling, new retainer ring/membrane
assembly, S-10 slurry, 60s polish took off >800A thermal ox.  Seems
faster.  Leaving ~5mm non-polished edge due to thicker retainer ring.

3) New retainer ring is ~0.5-1.0mm thicker than 550um wafer.  It
should be 66-100% of wafer thickness to allow polishing out to the
edge of the wafer.  Does vendor have a different thickness of retainer
ring, or can this one be sent out to the machine shop for thinning?

Let me know if you have any other questions from this brief test.


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