From ynzhao at stanford.edu  Fri Jan 14 16:03:04 2005
From: ynzhao at stanford.edu (Sara Zhao)
Date: Fri, 14 Jan 2005 16:03:04 -0800
Subject: a question
Message-ID: <200501150002.j0F02djV002680@smtp3.Stanford.EDU>

Hello,

 

I am to release my cantilevers from the wafer. After the backside etch, and
box layer etch, the legs will freely stand out. (no si layer underneath). I
am to etch the box layer and the PR and have to make the wafer wet, do you
think I need cpd? IF yes, will the dryer be too turbulent to break the legs?
(the dimension is 3.5um thick, width varies from 5um, to 10um, 25, 50 and
75, length varies from 100, 200, 300, 400 to 500um. )

 

Also, does anyone know any way to dry etch PR? Sure I need it to be not to
violent because of the free standing legs.

 

Thanks very much.

 

sara

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