Problem drytek2 2002-09-06 18:01:04: Non-uniform etch rate; slowest at back right

[mcvittie at snf.stanford.edu]

Measured poly etch rate uniformity of top wafer by stopping 
right at endpoint. Found that back right was etching more than 17% slower than front left. This may because of water leak.
On second electrode there appears to be corrosion at the back
right of the electrode from a water leak.
	Jim