From hphan at snf.stanford.edu Wed Mar 5 09:04:03 2003 From: hphan at snf.stanford.edu (Henry Phan) Date: Wed, 05 Mar 2003 09:04:03 -0800 Subject: Updated Etch Rate and Operating procedure Message-ID: <3E662E03.B63BD5C5@snf.stanford.edu> Dear Users: In the past few weeks, I've been re-checking and updating the etch rate data for both dryteks and the amtetcher. I have also made some changes in the operating procedures. You will find these new documents in the log books. Please don't make any changes or write on the recipes posted in the logbooks. If you think a change should be made to either the etchrates or the operating procedures come see me. I find it disrespectful to both me and the other users of the equipment for anyone to squabble changes on the log sheets as has happened at the amtetcher. This information is not updated on the website if it does not go through me. Also, if you want to change the base pressure on the AMT, that's fine. But please put the pressure back to the standard one when you finish your process and do not write on the recipe. You are welcome to talk to me if you have any recommendations. From cbaxter at snf.stanford.edu Wed Mar 26 04:15:51 2003 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Mar 26, 2003 4:15:51 PM Subject: Shutdown drytek2 2003-03-26 16:15:50: Report Shutdown for drytek2 Message-ID: shutdown for routin maint. From cbaxter at snf.stanford.edu Wed Mar 26 06:02:06 2003 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Mar 26, 2003 6:02:06 PM Subject: Shutdown drytek2 2003-03-26 16:15:50: Report Clear for drytek2 Message-ID: completed oil changed