From beckwith at snf.stanford.edu  Fri Feb  6 15:44:56 2004
From: beckwith at snf.stanford.edu (beckwith at snf.stanford.edu)
Date: Fri, 6 Feb 2004 15:44:56 -0800
Subject: Comment drytek2 2004-02-06 15:44:53: reflected pwr high
Message-ID: <mailman.448.1357938286.25682.drytek2-pcs@snf.stanford.edu>

could not get reflected pwr below 60-80 on program 1 O2
descum



From kenney at snf.stanford.edu  Sun Feb 29 10:19:40 2004
From: kenney at snf.stanford.edu (kenney at snf.stanford.edu)
Date: Sun, 29 Feb 2004 10:19:40 -0800
Subject: Problem drytek2 2004-02-29 10:19:39: Plasma unstable
Message-ID: <mailman.449.1357938286.25682.drytek2-pcs@snf.stanford.edu>

When using Process #2 Poly Etch or Process #3 Nitride Etch
the system will run perfectly for a few minutes, then the plasma will deignite in either all plates or in the 3rd plate from the top.
It is easy to retune the RF to get back a perfect plasma condition, but it becomes unsatble within a few minutes and the 
plasma deignites again.