From latta at snf.stanford.edu Wed Sep 3 09:17:52 2008 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 3 Sep 2008 09:17:52 -0700 Subject: Comment drytek2 SNF 2008-08-02 16:31:48: process 1 timer set at 1 min, not stopping Message-ID: time vs laser toggle correct? From king at snf.stanford.edu Fri Sep 5 20:16:19 2008 From: king at snf.stanford.edu (king at snf.stanford.edu) Date: Fri, 5 Sep 2008 20:16:19 -0700 Subject: Comment drytek2 SNF 2008-09-05 20:16:16: Compressed air problems Message-ID: In case anyone else was hoping to use this tool, it is affected by the compressed air problem. From king at snf.stanford.edu Fri Sep 5 23:34:11 2008 From: king at snf.stanford.edu (king at snf.stanford.edu) Date: Fri, 5 Sep 2008 23:34:11 -0700 Subject: Comment drytek2 SNF 2008-09-05 23:34:10: Works fine now Message-ID: after the compressed air came back on. FYI. From lindaw at snf.stanford.edu Tue Sep 9 11:08:21 2008 From: lindaw at snf.stanford.edu (lindaw at snf.stanford.edu) Date: Tue, 9 Sep 2008 11:08:21 -0700 Subject: Problem drytek2 SNF 2008-09-09 11:08:21: the chamber purge is really high (and very loud) Message-ID: From lindaw at snf.stanford.edu Wed Sep 10 11:54:46 2008 From: lindaw at snf.stanford.edu (lindaw at snf.stanford.edu) Date: Wed, 10 Sep 2008 11:54:46 -0700 Subject: Problem drytek2 SNF 2008-09-10 11:54:45: The vent gas flow is WAY TOO HIGH!!! Message-ID: Chamber vents to atmosphere in ~2 seconds. From eenriquez at snf.stanford.edu Wed Sep 10 13:34:58 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 10 Sep 2008 13:34:58 -0700 Subject: Problem drytek2 SNF 2008-09-10 11:54:45: The vent gas flow is WAY TOO HIGH!!! Message-ID: Reduced nitrogen pressure from over 30 psi to 15 psi. Chamber now vents in about 20 sec. From eenriquez at snf.stanford.edu Wed Sep 10 13:35:16 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 10 Sep 2008 13:35:16 -0700 Subject: Problem drytek2 SNF 2008-09-09 11:08:21: the chamber purge is really high (and very loud) Message-ID: Reduced nitrogen pressure from over 30 psi to 15 psi. From eenriquez at snf.stanford.edu Wed Sep 10 18:43:30 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 10 Sep 2008 18:43:30 -0700 Subject: Comment drytek2 SNF 2008-09-05 20:16:16: Compressed air problems Message-ID: Archived From eenriquez at snf.stanford.edu Wed Sep 10 18:43:43 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 10 Sep 2008 18:43:43 -0700 Subject: Comment drytek2 SNF 2008-09-05 23:34:10: Works fine now Message-ID: Archived From lindaw at snf.stanford.edu Wed Sep 17 13:32:49 2008 From: lindaw at snf.stanford.edu (lindaw at snf.stanford.edu) Date: Wed, 17 Sep 2008 13:32:49 -0700 Subject: Comment drytek2 SNF 2008-09-17 13:32:48: The laser is on? Message-ID: someone has turned the laser on. From eenriquez at snf.stanford.edu Thu Sep 18 07:39:24 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 18 Sep 2008 07:39:24 -0700 Subject: Comment drytek2 SNF 2008-09-17 13:32:48: The laser is on? Message-ID: Turned the laser off. From latta at snf.stanford.edu Tue Sep 23 16:53:47 2008 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 23 Sep 2008 16:53:47 -0700 Subject: Comment drytek2 SNF 2008-09-23 16:53:47: ASML target program Message-ID: Poly etch program etch rate for Si = 2240A/min. Used Poly Etch for 30 secs and averaged 1220A. Uniformity is ok, not great, about 9% across the wafer.