Comment drytek2 SNF 2008-09-23 16:53:47: ASML target program

latta at latta at
Tue Sep 23 16:53:47 PDT 2008

Poly etch program etch rate for Si = 2240A/min.
Used Poly Etch for 30 secs and averaged 1220A.  Uniformity is ok, not great, about 9% across the wafer.

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