From booth at snf.stanford.edu  Wed Apr 12 10:38:29 2000
From: booth at snf.stanford.edu (Len Booth)
Date: Wed, 12 Apr 2000 10:38:29 -0700
Subject: Drytek2 - read the logbook etch rate info!
Message-ID: <38F4B495.5F019686@snf.stanford.edu>

	Drytek2 is available again - BUT -
the etch rates for the 6 electrodes are not
well matched.  A poly etch rate test was done
last night by Eric P. to document the current
etch rates, and the info is posted in the 
logbook at the machine.  Check the data
and choose which electrodes you want to use.
When time permits (one or two months???) we
will try to do a full balancing of the poly
etch rates.  We normally expect less than
10% non-uniformity between all electrodes
for poly etch.
			Len


From yiching at stanford.edu  Tue Apr 25 20:50:44 2000
From: yiching at stanford.edu (Yiching Liang)
Date: Tue, 25 Apr 2000 20:50:44 -0700 (PDT)
Subject: resist harden for heavy implants
Message-ID: <Pine.GSO.4.21.0004252048400.12518-100000@cardinal0.Stanford.EDU>

Hi-

Can someone tell me how long I need to run the resist harden program in
drytek2 to prep my wafers for high dose implants (5e15)?

Thanks.



Yiching