From rcrane at snf.stanford.edu  Fri Dec 13 16:41:48 2002
From: rcrane at snf.stanford.edu (Dick Crane)
Date: Fri, 13 Dec 2002 16:41:48 -0800
Subject: Shutdown, repair and upgrade
Message-ID: <3DFA7E4C.FCF9D016@snf.stanford.edu>

Drytek2 users:

In an effort to eliminate electrode water leaks, we are replacing the
current electrode stack with an enhanced, upgraded version which also
has six inch capability. This upgrade will require recharacterizing the
drytek as to etch rate, across wafer uniformity and wafer to wafer
uniformity.

Drytek2 will be shutdown as of Wednesday, December 18. Characterization
testing will start Monday, January 6, and the tool should be up for
general use by Friday, January 10.

Sorry for any scheduling inconvenience, but the upgrade will help
increase long term up-time.

Thanks,

Dick



From yyao at snf.stanford.edu  Tue Dec 17 09:59:27 2002
From: yyao at snf.stanford.edu (Yahong Yao)
Date: Tue, 17 Dec 2002 09:59:27 -0800
Subject: drytek2 1100-1200 & 1530-1630 released
Message-ID: <3DFF65FF.CF78A6A3@snf.stanford.edu>

done early.