Shutdown, repair and upgrade
rcrane at snf.stanford.edu
Fri Dec 13 16:41:48 PST 2002
In an effort to eliminate electrode water leaks, we are replacing the
current electrode stack with an enhanced, upgraded version which also
has six inch capability. This upgrade will require recharacterizing the
drytek as to etch rate, across wafer uniformity and wafer to wafer
Drytek2 will be shutdown as of Wednesday, December 18. Characterization
testing will start Monday, January 6, and the tool should be up for
general use by Friday, January 10.
Sorry for any scheduling inconvenience, but the upgrade will help
increase long term up-time.
More information about the drytek2