From cheng1 at stanford.edu Thu Jan 16 15:39:30 2003 From: cheng1 at stanford.edu (Ching-Hsiang Cheng) Date: Thu, 16 Jan 2003 15:39:30 -0800 Subject: reservation removed this evening Message-ID: <5.1.1.5.2.20030116153610.01dc8ed0@cheng1.pobox.stanford.edu> Dear Drytek2 users, I would like to remove my reservation for this evening since my wafers are not ready yet. But I am not sure the time I reserved since the Coral is currently down. I think it is sometime around 7 to 9pm. Ching-Hsiang From cheng1 at stanford.edu Fri Jan 17 15:17:33 2003 From: cheng1 at stanford.edu (Ching-Hsiang Cheng) Date: Fri, 17 Jan 2003 15:17:33 -0800 Subject: Reservation Cancelled 5-8pm today Message-ID: <5.1.1.5.2.20030117151537.01e08598@cheng1.pobox.stanford.edu> Dear drytek2 users, I have cancelled my reservation from 5 to 8 pm today since my wafers are not ready yet. Sorry for the short notice. Ching-Hsiang From mcvittie at snf.stanford.edu Fri Jan 17 18:37:37 2003 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Fri, 17 Jan 2003 18:37:37 -0800 Subject: Report on the Upgrade to Drytek2 Message-ID: <3E28BDF1.52EDC552@snf.stanford.edu> Drytek2 Users, I sent this note out on Tuesday but it only went to Equipment Archive. Drytek2 is open for general use. There have been a number improvements made to this etcher. Some of these improvements will affect such things as etch rate in the 10 to 15% range. Our plan to characterize all the std processes in terms of etch rates and selective in the coming weeks. This characterization will be done using the reservation system without any tool shut downs. Here is what is new on Drytek2: 1. New electrodes with larger water lines. This was done to repair water leaks in the old electrodes which were affecting etch uniformity and etch rates. The vac leak rate is now < 1mT/min. For the std poly etch process, the across wafer uniformity is now < +/- 5 %. This was measured using a 5pt measurement with edge point 1 cm from edge. U = Max ? Min / 2x mean 2. Clean up of front load door. Because of acid on user gloves, the load door had gotten badly corroded. 3. Rebalancing of power to electrodes. This was done to improve electrode-to-electrode uniformity. This uniform is now also < +/- 5 % for the std poly etch. 4. Replaced gate valve. This was done to repair a leak across the gate valve which it impossible to measure the vac leak rate. Note that the new valve is significantly louder than the old one. It would be nice if we can fine the time to add a slow pump step during the coming year. Other Issues: 1. Uniformity depends on process conditions, so do not expect < 5% uniformity on all processes. We have a multi-electrode readout box that I am going leave available by the side of tool. It gives a rough indication of how the power to the different electrodes changes as you change from the std poly etch process. 2. The new electrodes are thicker. This results in a reduction in the gap between the electrodes and an increase in plasma density for a constant rf power. Thus, you should expect to see an increase in etch rate if you run the old process conditions. For the std poly etch (150 mT, 375W, 50/50 SF6/C2ClF5), we measured a 17% (1670 A/min vs 1340 A/min undopedpoly) increase in etch rate compared to the old value in the book. To get the exact same results as before, I expect you will need to cut the power 10 to 15%. We will be testing all the std process to determine the new etch rate and sel. 4. The gas flow meters need some recalibration but are not that far off. Using a rate of pressure increase, we found that a SF6 flow readout of 53sccm gives the same flow as C2ClF5 with a flow readout of 50 sccm. We will be doing this recalibration in the weeks to come. For now for the poly etch process, use 53 sccm of SF6 and 50 sccm of C2ClF5. I will try to keep you informed as I have new info on process results. I expect you will be seeing better etch results from the tool. Thanks, Jim McVittie ps. Be sure to thank Len and Henry for all their work on the tool. From GaryYamaNet at netscape.net Fri Jan 17 20:26:27 2003 From: GaryYamaNet at netscape.net (GaryYamaNet at netscape.net) Date: Fri, 17 Jan 2003 23:26:27 -0500 Subject: done early, free to 10pm Message-ID: <565A3869.3F2237D6.37F17E86@netscape.net> __________________________________________________________________ The NEW Netscape 7.0 browser is now available. Upgrade now! http://channels.netscape.com/ns/browsers/download.jsp Get your own FREE, personal Netscape Mail account today at http://webmail.netscape.com/