From rcrane at snf.stanford.edu  Thu May  1 15:53:52 2003
From: rcrane at snf.stanford.edu (Dick Crane)
Date: Thu, 01 May 2003 15:53:52 -0700
Subject: Freon115 nears empty
Message-ID: <3EB1A580.FFC81388@snf.stanford.edu>

All,

The freon115 cylinder is approaching empty and it is time to switch to
freon22. If the pressure gauge is to be believed, the gas will run out
in five weeks. I wish to switch to freon22 on May 23 and avoid any
unscheduled gas outages. Please plan accordingly. Etch testing on
freon22 has been completed and is awaiting Jim McVittie's blessing.

Thanks,

Dick



From rcrane at snf.stanford.edu  Mon May 12 17:07:11 2003
From: rcrane at snf.stanford.edu (Dick Crane)
Date: Mon, 12 May 2003 17:07:11 -0700
Subject: [Fwd: Freon115 nears empty]
Message-ID: <3EC0372F.FFFEF8FE@snf.stanford.edu>

Kind reminder. Cylinder pressure is 20psi. The end is near.

Dick Crane wrote:

> All,
>
> The freon115 cylinder is approaching empty and it is time to switch to
> freon22. If the pressure gauge is to be believed, the gas will run out
> in five weeks. I wish to switch to freon22 on May 23 and avoid any
> unscheduled gas outages. Please plan accordingly. Etch testing on
> freon22 has been completed and is awaiting Jim McVittie's blessing.
>
> Thanks,
>
> Dick



From mcvittie at cis.Stanford.EDU  Tue May 13 09:24:07 2003
From: mcvittie at cis.Stanford.EDU (Jim McVittie)
Date: Tue, 13 May 2003 09:24:07 -0700 (PDT)
Subject: F115-Replacement
Message-ID: <Pine.LNX.4.44.0305130913550.25424-101000@cis.Stanford.EDU>

Drytek Users,

Attached is a Word file giving the details of using F-22 (CHClF2) as a
replacement for F-115 for poly-Si etching. We looked at a number of
Freons. Of these F-22 gave the best results however it is not as good as
F-115 was in it has a bit more undercut. Shortly, I will send out a 
summary of the results that we have for using F-22 with SF6 for Si 
etching. 

Thanks,
			Jim 	
--------------------------------------------------------------
James P. McVittie	                Senior Research Scientist
Allen Center for Integrated Systems     jmcvittie at stanford.edu
Stanford University             	Tel: (650) 725-3640	
Rm. 336, 330 Serra Mall			Fax: (650) 723-4659
Stanford, CA 94305-4075	
-------------- next part --------------
A non-text attachment was scrubbed...
Name: F115-Replacement.doc
Type: application/msword
Size: 880128 bytes
Desc: 
URL: <http://snf.stanford.edu/pipermail/drytek2/attachments/20030513/22d958e6/attachment.doc>

From mcvittie at cis.Stanford.EDU  Tue May 13 10:56:25 2003
From: mcvittie at cis.Stanford.EDU (Jim McVittie)
Date: Tue, 13 May 2003 10:56:25 -0700 (PDT)
Subject: F115-Replacement- Correction
Message-ID: <Pine.LNX.4.44.0305131053430.25424-101000@cis.Stanford.EDU>

Drytek Users,

Sorry, I mislabeled the SEM pictures in the previous report that I sent 
out.
			Jim 	

---------- Forwarded message ----------
Date: Tue, 13 May 2003 09:24:07 -0700 (PDT)
From: Jim McVittie <mcvittie at cis.Stanford.EDU>
To: Drytek2 at snf, drytek1 at snf
Subject: F115-Replacement

Drytek Users,

Attached is a Word file giving the details of using F-22 (CHClF2) as a
replacement for F-115 for poly-Si etching. We looked at a number of
Freons. Of these F-22 gave the best results however it is not as good as
F-115 was in that it has a bit more undercut. Shortly, I will send out a 
summary of the results that we have for using F-22 with SF6 for Si 
etching. 

Thanks,
			Jim 	
--------------------------------------------------------------
James P. McVittie	                Senior Research Scientist
Allen Center for Integrated Systems     jmcvittie at stanford.edu
Stanford University             	Tel: (650) 725-3640	
Rm. 336, 330 Serra Mall			Fax: (650) 723-4659
Stanford, CA 94305-4075	
-------------- next part --------------
A non-text attachment was scrubbed...
Name: F115-Replacement.doc
Type: application/msword
Size: 892928 bytes
Desc: 
URL: <http://snf.stanford.edu/pipermail/drytek2/attachments/20030513/0914e008/attachment.doc>

From sanli at piezo.Stanford.EDU  Fri May 16 14:11:17 2003
From: sanli at piezo.Stanford.EDU (Sanli Ergun)
Date: Fri, 16 May 2003 14:11:17 -0700 (PDT)
Subject: res. cancelled today 05/16
Message-ID: <Pine.GSO.4.44.0305161410090.27950-100000@megarayl.Stanford.EDU>


I can't get my wafers ready. Sorry for the late notice.

Sanli



From booth at snf.stanford.edu  Mon May 19 10:09:15 2003
From: booth at snf.stanford.edu (Len Booth)
Date: Mon, 19 May 2003 10:09:15 -0700
Subject: Near end of F-115
Message-ID: <3EC90FBB.979ECCF1@snf.stanford.edu>

	Our last supply of Freon 115 is very nearly
empty.  We are hoping that it will last until this
Friday may 23rd, when we expect to remove the F-115
bottle and replace it with a large new bottle of
F-22.  I've put a plot of the F-115 bottle pressure
at Drytek2 for your inspection, updated as of this
morning, Monday May 19th.  There will be no more F-115.
	If the bottle becomes empty before this 
Friday, we will have to make the change sooner than
scheduled.  
	Jim McVittie has process data showing the
changes in etching characteristics when switching
to recipes which will use F-22.
			Len


From sanli at piezo.Stanford.EDU  Tue May 20 13:26:27 2003
From: sanli at piezo.Stanford.EDU (Sanli Ergun)
Date: Tue, 20 May 2003 13:26:27 -0700 (PDT)
Subject: cancel res. 05/20 17:30
Message-ID: <Pine.GSO.4.44.0305201324040.2203-100000@megarayl.Stanford.EDU>


I was able to finish my wafers early.

Sanli




From rcrane at snf.stanford.edu  Wed May 21 08:14:59 2003
From: rcrane at snf.stanford.edu (Dick Crane)
Date: Wed, 21 May 2003 08:14:59 -0700
Subject: Freon115 changes to Freon22 tomorrow
Message-ID: <3ECB97F3.B00C0C01@snf.stanford.edu>

All,

The freon 115 cylinder has 2-3psi remaining and it is now time to switch
to
freon 22. The change will occur tomorrow morning, Thursday, May 22, at
0700, one day earlier than originally scheduled.

Please see McVittie's May 13th memo for process changes

Thanks,

Dick





From booth at snf.stanford.edu  Fri May 23 15:36:53 2003
From: booth at snf.stanford.edu (Len Booth)
Date: Fri, 23 May 2003 15:36:53 -0700
Subject: Drytek poly-etch using Freon-22
Message-ID: <3ECEA285.F938D35F@snf.stanford.edu>

Drytek users -
        As you know by now, the F-115 is gone, and
has been replaced by F-22.
        Jim McVittie & Henry have done characterization
of the F-22 in the poly etch process.  The contact 
cleanup process is not working yet - additional process
changes are being developed by Jim McVittie this weekend.
Do NOT use the contact cleanup etch in the Dryteks
until Jim has finished developing a new process.

        Those of you using poly-etch recipes which now are
using F-22, a temporary multiplier must be factored into
the dial setting that you must now use for the F-22 (MFC-3).

MFC-3   flowing F-115   @ max setpoint 240= real flow of 240sccm

MFC-3   flowing F-22    @ max setpoint 240= real flow of 110sccm

        Therefore those of you using F-22 in MFC-3 should 
expect the setpoint range to be from 0 to 240 on the dial,
which will corespond to 0 to 110 sccm of F-22 measured flow
on the digital readout.

Examples for setting using F-22 in MFC-3:

	dial setting	digital flow	real F-22
			readout		Flow sccm
	240		238		110
	120		119		 55
	060		062		 27
	044		044		 20
	030		031		 13

        By next week we hope to correct the old recipe spec
information.
                        Len