F115-Replacement

[Jim McVittie]

Drytek Users,

Attached is a Word file giving the details of using F-22 (CHClF2) as a
replacement for F-115 for poly-Si etching. We looked at a number of
Freons. Of these F-22 gave the best results however it is not as good as
F-115 was in it has a bit more undercut. Shortly, I will send out a 
summary of the results that we have for using F-22 with SF6 for Si 
etching. 

Thanks,
			Jim 	
--------------------------------------------------------------
James P. McVittie	                Senior Research Scientist
Allen Center for Integrated Systems     jmcvittie at stanford.edu
Stanford University             	Tel: (650) 725-3640	
Rm. 336, 330 Serra Mall			Fax: (650) 723-4659
Stanford, CA 94305-4075	
-------------- next part --------------
A non-text attachment was scrubbed...
Name: F115-Replacement.doc
Type: application/msword
Size: 880128 bytes
Desc: 
URL: <http://snf.stanford.edu/pipermail/drytek2/attachments/20030513/22d958e6/attachment.doc>