problem with etching

[Arash Hazeghi]

Hi,

I used process #2 (poly etch)  last week for etching Si, I had used the
program before and it worked, it should have etched ~ 1200A (30sec) but it
had etched only 400A (measured accurately with AFM). I did season the
chamber. During the dummy run I noticed instability in SF6 flow rate for
about ~2minutes but the flow stabilized and remained fixed at 117sccm during
the actual run. Power was normal.

 

What was the possible problem, have the etch rates changed since a few
months ago?

 

 

Thanks,

Arash

 

 

 

 

Arash Hazeghi

 

 

PhD Candidate

Paul G. Allen Center for Integrated systems,

420 Via Palou Mall, Stanford, CA 94305, USA

 

office: +1-650-725-0418

cell: +1-650-353-1866

 

web: http://www.stanford.edu/~ahazeghi

 

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