From zejnty at 211.233.89.41 Wed Apr 9 04:20:21 2008 From: zejnty at 211.233.89.41 (Vacxq) Date: Wed, 9 Apr 2008 19:20:21 +0800 Subject: Hello:drytek4-pcs. Message-ID: drytek4-pcs ??: ????,???? http://pokkj.qingyuan88.cn ???????????????????????????????? 20080409192021 From jiu at jiufu.com Wed Apr 9 22:49:05 2008 From: jiu at jiufu.com (=?GB2312?B?zfTNr9Pv?=) Date: Thu, 10 Apr 2008 13:49:05 +0800 Subject: =?GB2312?B?0tTIy86qsb5kcnl0ZWs0LXBjcw==?= Message-ID: ???????: ??????????????????????80???????????????????????????????????????????????2000????? ??????????????????????????????????????????????????????????????????????????? ???????????????????????????????????????????????????????? ????????????????????????????????????????????????????????????????????? ??: ???????????????????? ??????????????26???????????????200?? ?????0532-87973237?87973257 ??????????? ?????87973217?13001662328 ?13070895377 ??? ????? dongshan220 at gmail.com djbidd at sohu.com ???87973257?87973237?87973055 ????????||||||||||||||||||||||||||||||||||||||||||||||| ???????????????http://www.fuqingyuan.com/zong.html ????????http://www.fuqingyuan.com/download/bjd.htm ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||| ?????http://www.fuqingyuan.com/shop/class.asp ????? http://www.fuqingyuan.com/ From eenriquez at snf.stanford.edu Mon Apr 14 14:56:32 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Apr 2008 14:56:32 -0700 Subject: Comment drytek4 SNF 2008-04-14 14:56:32: Update Message-ID: Platten water flow is steadily improving. Now able to flow about 0.1 gpm (spec is >0.2 gpm). After repairing a vacuum leak, I ran an O2 plasma with no problems. I will continue to flush the cooling over night to see if we can improve the flow even more. From eenriquez at snf.stanford.edu Tue Apr 15 09:35:07 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 15 Apr 2008 09:35:07 -0700 Subject: Shutdown drytek4 SNF 2008-03-14 15:28:00: RF Power supply making a popping noise Message-ID: Jim McVittie repaired the matching network. Flushed out the platten cooling line. Use only Process button 2 and 3, Process 1 does not work. Will need to troubleshoot. From eenriquez at snf.stanford.edu Tue Apr 15 09:35:27 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 15 Apr 2008 09:35:27 -0700 Subject: Comment drytek4 SNF 2008-03-17 10:26:58: Update Message-ID: Jim McVittie repaired the matching network. Flushed out the platten cooling line. Use only Process button 2 and 3, Process 1 does not work. Will need to troubleshoot. From eenriquez at snf.stanford.edu Tue Apr 15 09:35:45 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 15 Apr 2008 09:35:45 -0700 Subject: Comment drytek4 SNF 2008-03-24 09:25:39: Up-date Message-ID: Parts arrived From eenriquez at snf.stanford.edu Tue Apr 15 09:36:07 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 15 Apr 2008 09:36:07 -0700 Subject: Comment drytek4 SNF 2008-04-14 14:56:32: Update Message-ID: Jim McVittie repaired the matching network. Flushed out the platten cooling line. Use only Process button 2 and 3, Process 1 does not work. Will need to troubleshoot. From eenriquez at snf.stanford.edu Tue Apr 15 09:37:09 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 15 Apr 2008 09:37:09 -0700 Subject: Comment drytek4 SNF 2008-04-15 09:37:07: Update Message-ID: Process 1 button does not work. Use only Process 2 & 3. From eenriquez at snf.stanford.edu Wed Apr 16 16:23:28 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 16 Apr 2008 16:23:28 -0700 Subject: Comment drytek4 SNF 2008-04-16 16:23:27: Platten chiller installed Message-ID: We installed a water chiller/recirculator Instead of using process cooling water to cool the platen in order to prevent the lines from chronically clogging up. The flow however is much less. When connected to the process cooling, the flow is about 0.1 gpm but when connected to the chiller, the flow is only 0.03 gpm. We believe that should be OK to run. I ran an O2 process at 175W for 35 minutes with no problems. The temperature difference between the water inlet and outlet was about 7C. The chiller temp is currently set at 24C (per Jim Krugger's request). The process cooling water is about 18C. Please run a dummy wafer to verify your process before comitting your device. From eenriquez at snf.stanford.edu Mon Apr 21 13:54:04 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 21 Apr 2008 13:54:04 -0700 Subject: Comment drytek4 SNF 2008-04-16 16:23:27: Platten chiller installed Message-ID: Chiller pump failed. Reconnected platten cooling line to process cooling water. From jperez at snf.stanford.edu Fri Apr 25 13:37:33 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Fri, 25 Apr 2008 13:37:33 -0700 Subject: Shutdown drytek4 SNF 2008-04-25 13:37:33: Water flow to lower electrode is low Message-ID: From eenriquez at snf.stanford.edu Fri Apr 25 14:43:47 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 25 Apr 2008 14:43:47 -0700 Subject: Shutdown drytek4 SNF 2008-04-25 13:37:33: Water flow to lower electrode is low Message-ID: Should be OK to run. Previous test shows that even at a flow rate of 0.3gpm, the outlet temperature only increased by 7 C after running 175W plasma for 35 min. Please run a dummy wafer to verify your process before comitting your device. From jperez at snf.stanford.edu Mon Apr 28 09:32:49 2008 From: jperez at snf.stanford.edu (jperez at snf.stanford.edu) Date: Mon, 28 Apr 2008 09:32:49 -0700 Subject: Shutdown drytek4 SNF 2008-04-28 09:32:48: water flow needs to purged for lower eletrode Message-ID: From eenriquez at snf.stanford.edu Tue Apr 29 07:21:54 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 29 Apr 2008 07:21:54 -0700 Subject: Shutdown drytek4 SNF 2008-04-28 09:32:48: water flow needs to purged for lower eletrode Message-ID: OK to run for processes less than 30 min. long. Previous test shows that even at a flow rate of 0.03gpm, the outlet temperature only increased by 7 C after running 175W plasma for 35 min. Please run a dummy wafer to verify your process before comitting your device. From eenriquez at snf.stanford.edu Tue Apr 29 07:24:00 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 29 Apr 2008 07:24:00 -0700 Subject: Problem drytek4 SNF 2008-04-29 07:23:59: Low water flow through lower electrode Message-ID: OK to run for processes less than 30 min. long. Previous test shows that even at a flow rate of 0.03gpm, the outlet temperature only increased by 7 C after running 175W plasma for 35 min. Please run a dummy wafer to verify your process before comitting your device.