From maurice at stanford.edu Wed Mar 2 17:02:07 2011 From: maurice at stanford.edu (maurice stevens) Date: Wed, 02 Mar 2011 17:02:07 -0800 Subject: Epi2 Wafer handling update Message-ID: <4D6EE88F.1030704@stanford.edu> The wafer lift issue has gotten worse. Ted has contacted AMAT FS. We hope to have this resolved tomorrow. -- maurice at stanford.edu Maurice Stevens Stanford Nanofabrication Facility CIS Room 142, Mail Code 4070 Stanford, CA 94305 P. (650)725-3660 F. (650)725.6278 From maurice at stanford.edu Fri Mar 4 15:35:58 2011 From: maurice at stanford.edu (maurice stevens) Date: Fri, 04 Mar 2011 15:35:58 -0800 Subject: Dome coated/ down for the weekend Message-ID: <4D71775E.4000904@stanford.edu> A user reported flakes on their wafer so we opened the dome and found it severely coated. We ran many long etches to clean it up but saw little improvement. The system will purge in N2 over the weekend to reduce the HCl in the chamber and the dome will be changed on Monday. We will also inspect the susceptor and lower dome at that time. After the system is closed up it will take a couple of days before we get haze free depositions. We don't expect the system to be up until Wed. -- maurice at stanford.edu Maurice Stevens Stanford Nanofabrication Facility CIS Room 142, Mail Code 4070 Stanford, CA 94305 P. (650)725-3660 F. (650)725.6278 From maurice at stanford.edu Thu Mar 10 16:06:50 2011 From: maurice at stanford.edu (maurice stevens) Date: Thu, 10 Mar 2011 16:06:50 -0800 Subject: Epi back up Message-ID: <4D79679A.4090109@stanford.edu> System is back together. Dome, lower chamber liners replaced. Leak check completed. System baked out and etched. Si deposition at 1000c is haze free. The system was down for a week, it pulled staff time away from other tools that also needed attention and cost ~$10,000 in parts. The dome should not get coated if recipes are less than the 3um limit. If you are not sure that your recipes will not cause problems then you should ask the staff for recommendations. In the future, if it is determined that your process caused machine failure you (group or your company) may be held responsible for the cost of the replacement parts and your qualification removed from the tool. -- maurice at stanford.edu Maurice Stevens Stanford Nanofabrication Facility CIS Room 142, Mail Code 4070 Stanford, CA 94305 P. (650)725-3660 F. (650)725.6278 From grahamab at snf.stanford.edu Mon Mar 14 08:41:04 2011 From: grahamab at snf.stanford.edu (Andrew Graham) Date: Mon, 14 Mar 2011 08:41:04 -0700 Subject: epi2 released 1-5pm today Message-ID: Sorry for the semi-late notice. -------------- next part -------------- An HTML attachment was scrubbed... URL: From maurice at stanford.edu Tue Mar 15 17:13:09 2011 From: maurice at stanford.edu (maurice stevens) Date: Tue, 15 Mar 2011 17:13:09 -0700 Subject: Wafer dropped in chamber Message-ID: <4D800095.7000408@stanford.edu> Last night the system lost a wafer in the chamber. Luckily nothing broke inside. But chamber had to be opened to recover the wafer. Ted and Sean (AMAT FS) worked on the wafer handling today and reset the system to recover control of LLA. There still need to be a few more adjustments tomorrow before we pump down the chamber and start baking it out. We don't expect the system up until Thurs at the earliest. I have attached a picture of the lost lonely wafer. -- maurice at stanford.edu Maurice Stevens Stanford Nanofabrication Facility CIS Room 142, Mail Code 4070 Stanford, CA 94305 P. (650)725-3660 F. (650)725.6278 -------------- next part -------------- A non-text attachment was scrubbed... Name: lost wafer.JPG Type: image/jpeg Size: 24627 bytes Desc: not available URL: From maurice at stanford.edu Wed Mar 16 17:59:30 2011 From: maurice at stanford.edu (maurice stevens) Date: Wed, 16 Mar 2011 17:59:30 -0700 Subject: Epi2 up Message-ID: <4D815CF2.90006@stanford.edu> Wafer removed Wafer lift pin replaced System reset to recover control of LLA Wafer handling from both loadlocks calibrated Wafer centering on susceptor checked from both loadlocks Interface between epi and loadlock pump basement reset System baked out and etched Si deposition completed and is haze free system back to users From junam at stanford.edu Fri Mar 18 14:42:59 2011 From: junam at stanford.edu (Ju Hyung Nam) Date: Fri, 18 Mar 2011 14:42:59 -0700 (PDT) Subject: epi2 free: 3:30pm~8:30pm Message-ID: <1427697729.206704.1300484579216.JavaMail.root@zm07.stanford.edu> Previous run (hours ago) did not go as I thought. Need to re-write the process. Sorry for the last minute notice. From cfchiang at stanford.edu Fri Mar 18 15:25:41 2011 From: cfchiang at stanford.edu (Chia-Fang Chiang) Date: Fri, 18 Mar 2011 15:25:41 -0700 (PDT) Subject: epi2 free 8:30 - 10:00pm Message-ID: <1241242343.135968.1300487141799.JavaMail.root@zm06.stanford.edu> got an earlier slot From maurice at stanford.edu Wed Mar 23 15:57:20 2011 From: maurice at stanford.edu (maurice) Date: Wed, 23 Mar 2011 15:57:20 -0700 Subject: Epi2 down/dome damaged/no delivery date yet Message-ID: <4D8A7AD0.8080409@stanford.edu> The dome we put in last week has been coated and is damaged beyond repair. The dome that was taken out of the system went out for fire polishing and we are checking it's status. We are also contacting AMAT for the delivery time of a new one. I am sure I stressed the importance of the chamber etches during training but it seems everyone is not on the same page. If the chamber etch is not run or run to completion the dome could get coated. When the dome is coated you no long have the normal control of the temperature...so your process is not controlled. Once the dome gets coated there is a risk of damaging the the system ...and possible implosion of the chamber. If the etch does not complete because of an error then don't run your process. Try to run another etch. If you can'tcomplete an etch then put the system down. Also, your depositions should be less than three (3) microns. If you have not measured your deposition and know that your deposition are less than 3 microns then come talk to me or Ted Kamins. -m