From yy7343 at hotmail.com Thu Aug 14 10:57:26 2003 From: yy7343 at hotmail.com (Yahong Yao) Date: Thu, 14 Aug 2003 10:57:26 -0700 Subject: Si-Au bonding by EVbond Message-ID: Dear EVbond users, I haven?t used the tool for Au-Si bonding for quite a while. Anybody did such bonding recently? I would like to discuss with you about the bonding conditions to save some possible struggles on the tool. Your response is very much appreciated. Regards, Yahong _________________________________________________________________ The new MSN 8: advanced junk mail protection and 2 months FREE* http://join.msn.com/?page=features/junkmail From mahnaz at snf.stanford.edu Wed Aug 20 16:47:33 2003 From: mahnaz at snf.stanford.edu (Mahnaz) Date: Wed, 20 Aug 2003 16:47:33 -0700 Subject: Chuck Message-ID: <3F440895.469775D8@snf.stanford.edu> Hello all, I am wondering where is one of the two chucks. Please bring it back immediately or at least let me know where is the chuck.